芯片大混战将启：高通、联发科涉足笔记本，AMD 被曝入局手机_老虎社区_美港股上老虎

芯片大混战将启：高通、联发科涉足笔记本，AMD 被曝入局手机

砍柴网11-20

11 月 20 日消息，Smartphone Magazine 于 11 月 18 日发布博文，报道称 AMD 正将目光转向移动行业，计划推出类似 APU 的 Ryzen AI 移动 SoC 芯片，直接和高通、联发科等公司竞争。IT之家援引消息源报道，AMD 移动芯片的核心竞争力是性能功耗比，该公司此前推出的 Phoenix、Hawk Point 和 Strix Point 等 APU 产品均有...

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{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2484139349?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-11-20 00:00","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2484139349","market":"us","top_or_hot":-1,"title":"芯片大混战将启：高通、联发科涉足笔记本，AMD 被曝入局手机","media":"砍柴网","content":"<div>\n<p>11 月 20 日消息，Smartphone Magazine 于 11 月 18 日发布博文，报道称 AMD 正将目光转向移动行业，计划推出类似 APU 的 Ryzen AI 移动 SoC 芯片，直接和高通、联发科等公司竞争。IT之家援引消息源报道，AMD 移动芯片的核心竞争力是性能功耗比，该公司此前推出的 Phoenix、Hawk Point 和 Strix Point 等 APU 产品均有...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241120110753abd0d0d3&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>芯片大混战将启：高通、联发科涉足笔记本，AMD 被曝入局手机</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n芯片大混战将启：高通、联发科涉足笔记本，AMD 被曝入局手机\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-11-20 00:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241120110753abd0d0d3&s=b><strong>砍柴网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>11 月 20 日消息，Smartphone Magazine 于 11 月 18 日发布博文，报道称 AMD 正将目光转向移动行业，计划推出类似 APU 的 Ryzen AI 移动 SoC 芯片，直接和高通、联发科等公司竞争。IT之家援引消息源报道，AMD 移动芯片的核心竞争力是性能功耗比，该公司此前推出的 Phoenix、Hawk Point 和 Strix Point 等 APU 产品均有...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241120110753abd0d0d3&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4141","symbol_name":"半导体产品","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241120110753abd0d0d3&s=b","article_id":"2484139349","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241120110753abd0d0d3&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2484139349","pubTimestamp":1732032000,"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"11 月 20 日消息，Smartphone Magazine 于 11 月 18 日发布博文，报道称 AMD 正将目光转向移动行业，计划推出类似 APU 的 Ryzen AI 移动 SoC 芯片，直接和高通、联发科等公司竞争。芯片巨头正积极开辟战场，开启新一轮的混战，此前消息称联发科携手英伟达，要推出首款消费级笔记本芯片，而高通目前已通过骁龙 X Elite 和 X Plus 芯片，携手微软推出 Windows 11 AI+ PC 设备。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"BK4141":"半导体产品","LU1046421795.USD":"富达环球科技A-ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","AMD":"美国超微公司","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0079474960.USD":"联博美国增长基金A","BK4554":"元宇宙及AR概念","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4532":"文艺复兴科技持仓","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4585":"ETF&股票定投概念","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","SG9999001424.SGD":"United E-Commerce Fund SGD","BK4534":"瑞士信贷持仓","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","QCOM":"高通","BK4566":"资本集团","GFS":"GLOBALFOUNDRIES Inc.","BK4588":"碎股","BK4575":"芯片概念","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","BK4527":"明星科技股","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","SG9999015978.USD":"利安颠覆性创新基金A","BK4579":"人工智能"},"translate_title":"The chip melee is about to begin: Qualcomm and MediaTek are involved in notebooks, and AMD is exposed to mobile phones","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1,"QCOM":1,"GFS":1},"content_text":"11 月 20 日消息，Smartphone Magazine 于 11 月 18 日发布博文，报道称 AMD 正将目光转向移动行业，计划推出类似 APU 的 Ryzen AI 移动 SoC 芯片，直接和高通、联发科等公司竞争。IT之家援引消息源报道，AMD 移动芯片的核心竞争力是性能功耗比，该公司此前推出的 Phoenix、Hawk Point 和 Strix Point 等 APU 产品均有不俗的表现。值得注意的是，AMD 的 RDNA 光线追踪和 FSR 等部分技术，此前已经应用于三星的 Exynos 芯片，而这些应用装备在 Galaxy 系列智能手机中。如果传闻属实，AMD 这次将直接采用完整的 Ryzen 芯片方案，而非仅仅提供 IP 授权。AMD 进军智能手机市场的消息虽然仍属传闻，但其潜在影响不容忽视，此举将进一步加剧移动芯片市场的竞争，也为 AMD 带来新的增长机遇。芯片巨头正积极开辟战场，开启新一轮的混战，此前消息称联发科携手英伟达，要推出首款消费级笔记本芯片，而高通目前已通过骁龙 X Elite 和 X Plus 芯片，携手微软推出 Windows 11 AI+ PC 设备。【来源：IT之家】","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"Company Corporation","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false}}