明年全球晶圆设备支出冲高 SEMI 预估未来三年将斥资4000亿美元_老虎社区_美港股上老虎

明年全球晶圆设备支出冲高 SEMI 预估未来三年将斥资4000亿美元

爱集微09-28

国际半导体产业协会（SEMI）估计，2025至2027年间，半导体制造业者将支出4,000亿美元在12吋晶圆厂制造设备上，创新高纪录，以大陆支出最多、南韩次之、台湾第三。除半导体晶圆厂的区域化发展，资料中心和边缘装置AI芯片需求强劲，推升支出不断增长。SEMI于26日发布报告指出，全球12吋晶圆厂设备支出，预计今年将增加4%至993亿美元，2025年将增长24%至1,232亿美元，首次突破1,...

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