台积电错失大客户？高通4nm旗舰芯，三星造！_老虎社区_美港股上老虎

台积电错失大客户？高通4nm旗舰芯，三星造！

智东西2021-06-09

据爆料者MauriQHD透露，美国芯片巨头高通将推出下一代旗舰手机SoC“骁龙895”芯片，它将基于韩国芯片巨头三星的4nm工艺。三星的这项制程工艺，不仅使高通骁龙系列的性能比之前更为突出，同时也增强了自身Exynos 2200处理器的性能。据悉，高通此前已与三星达成了一项8.5亿美元的合作协议，用于大规模生产骁龙888芯片。一、骁龙895：4nm工艺、ARM Cortex V9架构高通骁龙...

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7f5147ff
·2021-06-10
白癡高通可憐哪..🤣🤣
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88sidney
·2021-06-10
苹果太有钱了
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噴到外太空
·2021-06-09
每次都是三星制的有瑕疵，然后转单台积电
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- 第N次大变革大分流:
  台积电良率太高了，难以超越
  2021-06-09
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Derick的日间
·2021-06-09
台积电产能上不去
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- 第N次大变革大分流:
  台积电产能已经是全球第一
  2021-06-09
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第N次大变革大分流
·2021-06-09
台积电供不应求
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Qualcomm 4nm Flagship Core, Made in SAMSUNG EL.GDR!","themeId":null,"isJumpTheme":false,"ttsUrl":"https://static.tigerbbs.com/a58f5f99a1d933961d8dfe3a988c1b3e","symbols_score_info":{"QCOM":0.9,"SMSN.UK":0.9,"TSM":0.9},"content_text":"据爆料者MauriQHD透露，美国芯片巨头高通将推出下一代旗舰手机SoC“骁龙895”芯片，它将基于韩国芯片巨头三星的4nm工艺。三星的这项制程工艺，不仅使高通骁龙系列的性能比之前更为突出，同时也增强了自身Exynos 2200处理器的性能。\n据悉，高通此前已与三星达成了一项8.5亿美元的合作协议，用于大规模生产骁龙888芯片。\n一、骁龙895：4nm工艺、ARM Cortex V9架构\n高通骁龙888芯片，采用5nm制程工艺，它是目前安卓机型里顶级的旗舰级芯片，性能超过了联发科的天玑1200芯片和华为的麒麟9000芯片。骁龙888在5G连接能力、电竞游戏体验、AI运算架构以及移动影像技术等四个方面进行了巨大的提升。\n同时，骁龙888也是高通首颗整合了5G基带芯片的旗舰SoC。它采用Hexagon DSP设计，大幅度提升了AI运算水平，“十亿像素级”ISP也将拍照性能提升一大截，把移动智能手机终端的芯片性能做到了极致水平。目前，小米11、三星、realme、OPPO红魔游戏手机等厂商的旗舰系列都搭载了骁龙888处理器。\n有消息透露，代号为SM8450的高通下一代芯片或将命名为骁龙895，它采用4nm工艺制造，集成骁龙处理器X65 5G调制调解器，毫米波和Sub-6通信速度都有显著提升，这要比之前骁龙888芯片拥有更高的性能。\n其在架构方面，也采用了全新的ARM Cortex V9架构，能效提升30% ，性能提升10%;ISP是Spectra 680;FastConnect 6900子系统将支持蓝牙LE Audio/5.2和Wi-Fi 6E;CPU升级到Kryo 780，可能会首次引入Cortex-X2超大核心、Cortex-A710大核心以及Cortex-A510节能核心的组合;GPU也从之前的Adreno660转变成了全新的Adreno730，在图像处理方面有了极大的提升。\n\n▲高通骁龙895芯片相关参数\n骁龙X65还配备了高通5G PowerSave 2.0技术，这是一项基于3GPP Release 16定义的全新省电技术，可在联网状态唤醒信号，能带来更加优秀的功耗表现，大幅改善现有5G芯片功耗过高的痛点。骁龙895与骁龙X65的黄金组合势必会令5G旗舰手机的产品力进一步提升。\n二、三星台积电(TSM.US)垄断先进制成，4nm工艺将成主流\n随着技术的提升，芯片公司也在不断向精度高、功耗小的芯片发展。但全球能够实现4nm量产的芯片制造玩家，目前就只有韩国芯片巨头三星和台湾芯片制造商台积电两位选手了。\n在全球“缺芯潮”的影响下，台积电加快了新工艺的研发步伐。在今年台积电举办的2021技术论坛上，它声称4nm工艺研发方面进度非常顺利，预计将在2021年第三季度开始试产。\n台积电CEO魏哲家指出，他们将推出的4nm工艺可兼容5nm工艺的设计规则，相比5nm工艺更有性价比优势，计划在2022年量产。\n另外，台积电先进技术业务开发处处长袁立本提到：“出于成本考量，中低阶手机、消费电子等产品采用最先进制程技术时间会稍有延迟，目前多数采用16/12nm并正向6nm迈进，预计至2023年这类产品的主流技术将会是4nm。\n尽管台积电能提供比三星更好的工艺，但这次高通并没有与之合作。有猜测称，可能是因为台积电4nm工艺原本预计2021年第三季度试产，2022 年量产。但最近有消息传出，台积电量产日程提前至第四季度，且首波产能全部由苹果包下，将4nm工艺用于性能全面提升的Mac新品，这导致台积电无缘与高通合作。\n三、联发科手机SoC出货量第一，但旗舰级芯片仍追赶高通\n值得一提的是，高通的竞争对手联发科，它在5G时代通过搭载8核CPU的天玑720 5G SoC新品、旗舰8核架构的天玑800 5G芯片、采用7nm工艺制造的天玑1000芯片以及即将发布采用5nm工艺制造的天玑2000芯片等，一度达到了手机SoC出货量第一的号好成绩。特别在中端市场，联发科大量抢占了高通原有的份额，在2020年市场占有率甚至达到了27%。\n天风国际分析师郭明錤发布的最新报告指出，联发科的5G SoC优势关键在于，它与台积电紧密合作，推出适用于中端智能手机的芯片。但最近一方面，由于台积电的苹果(AAPL.US)合作，接下了量产4nm工艺的大单。另一方面，苹果预计最快于2023年在iPhone上采用自研的5G基带芯片，所以高通将被迫在中低端市场争取更多订单以弥补因苹果订单的流失，而这不利于联发科的生产。\n未来5G手机渗透率成长将放缓，所以联发科与高通的5G芯片业务成长最快时期已过。虽然联发科在今年第一季度市场占有率已达50-55%，超越了高通，但也意味着它未来成长空间有限。此外，在高端芯片方面，联发科仍无法取代高通。\n结语：4nm芯片市场成为焦点，依靠单一厂商或将存在钳制\n从这次透露出的消息和苹果提前预购台积电的芯片，可以看出，如今4nm工艺成为各大厂商争夺的关键资源，芯片光刻工艺进一步精细也成为未来发展的一大趋势。\n台积电和三星的4nm工艺仍是各大科技公司关注的对象。台积电因为苹果订单的涌入暂时填补了失去华为的空缺。但如果台积电过分依赖单一的厂商，未来在市场竞争的话语权抢夺上，可能会逐步落入下风。尤其是当三星、京东方等其它代工企业的技术逐渐赶超时，台积电过分依赖苹果的单一份额，或将成为钳制。","kind":"news","is_publish_news":true,"is_publish_highlight":true,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[{"id":183504800,"gmtCreate":1623334691700,"gmtModify":1623335410318,"author":{"id":"3462253857270973","authorId":"3462253857270973","name":"7f5147ff","avatar":"https://static.tigerbbs.com/e633bc538a187d03b99ae76ad59f839a","vip":1,"crmLevel":1,"crmLevelSwitch":0,"idStr":"3462253857270973","authorIdStr":"3462253857270973"},"htmlText":"白癡高通 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