传台积电提高封装订单，以满足人工智能需求_老虎社区_美港股上老虎

传台积电提高封装订单，以满足人工智能需求

智通财经2023-09-26

市场消息称，台积电已经提高了其先进封装的订单，以满足对面向人工智能的处理器的需求。台积电已经增加了为英伟达和AMD等公司生产GPU的cocos封装订单。由于工厂的生产问题，全球代工厂难以满足需求，特别是对CoWos包装的需求，CoWos的增长率约为30%。新封装的安装预计将在年底前完成，这可能使台积电(TSM)每月生产多达3万个芯片，是目前产量的两倍多。

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