台积电将为英伟达开发玻璃基板，首批芯片2025年问世_老虎社区_美港股上老虎

台积电将为英伟达开发玻璃基板，首批芯片2025年问世

爱集微08-30 20:52

玻璃基板已成为半导体市场的热门话题，一份新报告显示，台积电和英特尔正在积极扩大研发力度，英伟达也优先考虑在未来芯片中使用该技术。随着人工智能（AI）市场的迅速扩张，对创新技术的需求大幅增长，尤其是为了继续进行代际性能升级。英伟达等已经利用架构改进等发展技术，但现代硬件（特别是加速器）由更多组件构成，其中至关重要的组件是封装技术，而业界将玻璃基板视为从传统CoWoS封装向前...

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{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2463536087?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-08-30 20:52","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2463536087","market":"us","top_or_hot":-1,"title":"台积电将为英伟达开发玻璃基板，首批芯片2025年问世","media":"爱集微","content":"<div>\n<p>玻璃 基板已成为 半导体 市场的热门话题，一份新报告显示， 台积电 和 英特尔 正在积极扩大研发力度， 英伟达 也优先考虑在未来芯片中使用该技术。随着 人工智能 （AI）市场的迅速扩张，对 创新技术 的需求大幅增长，尤其是为了继续进行代际性能升级。英伟达等已经利用架构改进等发展技术，但现代硬件（特别是加速器）由更多组件构成，其中至关重要的组件是封装技术，而业界将玻璃基板视为从传统CoWoS封装向前...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202408302107379f694383&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>台积电将为英伟达开发玻璃基板，首批芯片2025年问世</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电将为英伟达开发玻璃基板，首批芯片2025年问世\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-08-30 20:52 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202408302107379f694383&s=b><strong>爱集微</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>玻璃 基板已成为 半导体 市场的热门话题，一份新报告显示， 台积电 和 英特尔 正在积极扩大研发力度， 英伟达 也优先考虑在未来芯片中使用该技术。随着 人工智能 （AI）市场的迅速扩张，对 创新技术 的需求大幅增长，尤其是为了继续进行代际性能升级。英伟达等已经利用架构改进等发展技术，但现代硬件（特别是加速器）由更多组件构成，其中至关重要的组件是封装技术，而业界将玻璃基板视为从传统CoWoS封装向前...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202408302107379f694383&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"NVDA","symbol_name":"英伟达","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202408302107379f694383&s=b","article_id":"2463536087","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202408302107379f694383&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2463536087","pubTimestamp":1725022374,"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"玻璃 基板已成为 半导体 市场的热门话题，一份新报告显示， 台积电 和 英特尔 正在积极扩大研发力度， 英伟达 也优先考虑在未来芯片中使用该技术。除此之外，据称台积电正在根据英伟达的需求为其未来的FOPLP开发玻璃基板，该技术将主要使用玻璃基板，并带来许多好处，特别是在芯片尺寸和单位面积晶体管比例增加方面。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"NVDA":"英伟达","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","BK4543":"AI","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU0072462426.USD":"贝莱德全球配置 A2","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","IE00B4JS1V06.HKD":"JANUS HENDERSON BALANCED \"A2\" (HKD) ACC","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","03145":"华夏亚洲高息股","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU0109392836.USD":"富兰克林科技股A","IE00BDRTCR15.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC A","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","BK4512":"苹果概念","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","BK4549":"软银资本持仓","IE0005OL40V9.USD":"JANUS HENDERSON BALANCED \"A6M\" (USD) INC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","BK4548":"巴美列捷福持仓","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","IE00BK4W5M84.HKD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (HKD) ACC","LU0061474705.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN \"AU\" (USD) ACC","TSM":"台积电","IE00BMPRXQ63.HKD":"NEUBERGER BERMAN NEXT GENERATION CONNECTIVITY FUND \"A\" (HKDHDG) ACC","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","LU0056508442.USD":"贝莱德世界科技基金A2","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4534":"瑞士信贷持仓","LU0077335932.USD":"FIDELITY AMERICAN GROWTH \"A\" INC","LU0069063385.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (USD) ACC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC"},"translate_title":"TSMC will develop glass substrates for Nvidia, and the first batch of chips will be released in 2025","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSM":0.9,"NVDA":0.9,"03145":0.6},"content_text":"玻璃 基板已成为 半导体 市场的热门话题，一份新报告显示， 台积电 和 英特尔 正在积极扩大研发力度， 英伟达 也优先考虑在未来芯片中使用该技术。随着 人工智能 （AI）市场的迅速扩张，对 创新技术 的需求大幅增长，尤其是为了继续进行代际性能升级。英伟达等已经利用架构改进等发展技术，但现代硬件（特别是加速器）由更多组件构成，其中至关重要的组件是封装技术，而业界将玻璃基板视为从传统CoWoS封装向前迈进的一种方式。一份报告称，台积电、英特尔、三星电子等正在大力投资玻璃基板研发工艺以实现突破，但由于该方案还不成熟，仍有很长的路要走。有趣的是，领先公司正是英特尔，因为英特尔已公布其玻璃基板计划十多年，据称已具备量产能力，在竞争中领先于所有其他公司。除此之外，据称台积电正在根据英伟达的需求为其未来的FOPLP（扇出型面板级封装）开发玻璃基板，该技术将主要使用玻璃基板，并带来许多好处，特别是在芯片尺寸和单位面积晶体管比例增加方面。鉴于台积电在这一特定领域的熟练程度，英特尔的“时机优势”不会对台积电产生太大影响，因为后者赢得了市场上主流客户的信任。该报告称，许多中国台湾制造商将玻璃基板视为“未来的投资”，与英特尔合作多年的钛升发起，集结相关供应链成立玻璃基板供应商E-core System联盟，抢食英特尔、台积电等订单。随着人工智能热潮进入下一步，很明显玻璃基板将在未来发挥巨大作用。此前报道透露，主要制造商瞄准2025-2026年解决方案进入市场的窗口期，英特尔和台积电将走在最前列。","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"Product Release","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false}}