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AMD苏姿丰：5nm制程产品预计明年推出样品

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{"i18n":{"language":"zh_CN"},"detailType":1,"isChannel":false,"data":{"magic":2,"id":119448096,"tweetId":"119448096","gmtCreate":1622561074215,"gmtModify":1622561074215,"author":{"id":3507797313824904,"idStr":"3507797313824904","authorId":3507797313824904,"authorIdStr":"3507797313824904","name":"91杨先生","avatar":"https://static.tigerbbs.com/dc270a8978e8af1ab985ac1856b50915","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":1,"crmLevelSwitch":0,"currentWearingBadge":{"badgeId":"e50ce593bb40487ebfb542ca54f6a561-2","templateUuid":"e50ce593bb40487ebfb542ca54f6a561","name":"资深虎友","description":"加入老虎社区1000天","bigImgUrl":"https://static.tigerbbs.com/0063fb68ea29c9ae6858c58630e182d5","smallImgUrl":"https://static.tigerbbs.com/96c699a93be4214d4b49aea6a5a5d1a4","grayImgUrl":"https://static.tigerbbs.com/35b0e542a9ff77046ed69ef602bc105d","redirectLinkEnabled":0,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2021.12.19","individualDisplayEnabled":0},"individualDisplayBadges":[],"fanSize":0,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"extraTitle":"","html":"<html><head></head><body><p>AMD YES&nbsp;</p></body></html>","htmlText":"<html><head></head><body><p>AMD YES&nbsp;</p></body></html>","text":"AMD YES","highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/119448096","repostId":2140804462,"repostType":2,"repost":{"id":"2140804462","pubTimestamp":1622546820,"share":"https://www.laohu8.com/m/news/2140804462?lang=&edition=full","pubTime":"2021-06-01 19:27","market":"us","language":"zh","title":"AMD苏姿丰：5nm制程产品预计明年推出样品","url":"https://stock-news.laohu8.com/highlight/detail?id=2140804462","media":"界面","summary":"台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。","content":"<div>\n<p>台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b\">Web Link</a>\n\n</div>\n","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD苏姿丰：5nm制程产品预计明年推出样品</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD苏姿丰：5nm制程产品预计明年推出样品\n</h2>\n\n<h4 class=\"meta\">\n\n\n2021-06-01 19:27 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b><strong>界面</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/fab3e6da33eab070d39ea5ddbb760010","relate_stocks":{"AMD":"美国超微公司"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202106011927077d48e2a5&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2140804462","content_text":"台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用台积电的7nm制程生产，并应用在超过30项产品上，至于5nm制程也进展顺利，正在开发中，相关产品预计将于明年可推出样品。","news_type":1},"isVote":1,"tweetType":1,"viewCount":1339,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["AMD"],"verified":2,"subType":0,"readableState":1,"langContent":"EN","currentLanguage":"EN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":6,"xxTargetLangEnum":"ORIG"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/119448096"}