AMD苏姿丰：5nm制程产品预计明年推出样品

界面2021-06-01

台湾《经济日报》6月1日消息，AMD首席执行官苏姿丰今日于Computex主题演讲中，揭露多项重大技术进展与业界合作，该公司与台积电在生产制程与封装技术两方面都合作紧密，发表3D小晶片（Chiplets）封装技术。另外，超微也携手特斯拉与三星，展现PC以外的新布局。苏姿丰说，AMD总是在思考下一步还可以发展什么，先进技术是其产品力的关键基础，这代表的是把最好制程技术与封装技术相结合，该公司已采用...

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91杨先生
2021-06-01
91杨先生
AMD YES

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