三星电子(SSNLF)将在年内推出高带宽内存（HBM）的3D封装服务

金吾财讯06-17

金吾财讯 | 据媒体援引三星电子(SSNLF)和消息人士的话称，三星电子将在年内推出高带宽内存（HBM）的3D封装服务，计划明年推出的第六代HBM芯片HBM4将采用这种封装方式。三星这项被称为SAINT-D的最新封装技术是在逻辑芯片上垂直堆叠HBM芯片，以进一步加快数据学习和推理处理速度。

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