德邦科技：公司晶圆划片膜已应用于CIS芯片的玻璃基板封装工艺

证券之星06-05

证券之星消息，德邦科技(688035)06月05日在投资者关系平台上答复投资者关心的问题。

投资者：您好！请问贵公司产品是否可用于玻璃基板封装？谢谢！

德邦科技董秘：您好，公司晶圆划片膜已应用于CIS芯片的玻璃基板封装工艺，感谢您的关注，谢谢！

以上内容由证券之星根据公开信息整理，由算法生成（网信算备310104345710301240019号），与本站立场无关，如数据存在问题请联系我们。本文为数据整理，不对您构成任何投资建议，投资有风险，请谨慎决策。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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德邦科技： 公司晶圆划片膜已应用于CIS芯片的玻璃基板封装工艺

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德邦科技：公司晶圆划片膜已应用于CIS芯片的玻璃基板封装工艺