688035 德邦科技
已收盘 07-03 15:00:02
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股市必读：6月26日德邦科技发布公告，股东减持149.35万股
证券之星 · 06-29
股市必读：6月26日德邦科技发布公告，股东减持149.35万股
每周股票复盘：大基金减持德邦科技（688035）1.05%股份
证券之星 · 06-28
每周股票复盘：大基金减持德邦科技（688035）1.05%股份
德邦科技：公司芯片级底部填充胶已在部分客户小批量的应用
证券之星 · 06-26
德邦科技：公司芯片级底部填充胶已在部分客户小批量的应用
德邦科技(688035.SH)：国家集成电路基金6月3日至6月26日减持公司149.35万股
智通财经 · 06-26
德邦科技(688035.SH)：国家集成电路基金6月3日至6月26日减持公司149.35万股
德邦科技（688035）披露2024年限制性股票激励计划归属结果公告，6月25日股价下跌2.26%
证券之星 · 06-25
德邦科技（688035）披露2024年限制性股票激励计划归属结果公告，6月25日股价下跌2.26%
每周股票复盘：德邦科技（688035）现2笔大宗交易机构净买入815.8万元
证券之星 · 06-14
每周股票复盘：德邦科技（688035）现2笔大宗交易机构净买入815.8万元
德邦科技：可实现功率器件封装（含硅基IGBT、碳化硅SiC器件等）
证券之星 · 06-12
德邦科技：可实现功率器件封装（含硅基IGBT、碳化硅SiC器件等）
德邦科技：芯片级封装材料固晶系列、UV膜系列、导热系列、芯片级底部填充胶（Underfill）、Lid 框粘接材料（AD胶）均可应用在储存芯片领域
证券之星 · 06-12
德邦科技：芯片级封装材料固晶系列、UV膜系列、导热系列、芯片级底部填充胶（Underfill）、Lid 框粘接材料（AD胶）均可应用在储存芯片领域
6月10日德邦科技现2笔大宗交易 机构净买入815.8万元
证券之星 · 06-10
6月10日德邦科技现2笔大宗交易 机构净买入815.8万元
6月9日德邦科技发生1笔大宗交易 成交金额2785.41万元
证券之星 · 06-09
6月9日德邦科技发生1笔大宗交易 成交金额2785.41万元
每周股票复盘：德邦科技（688035）发生大宗交易成交2709.67万元
证券之星 · 06-07
每周股票复盘：德邦科技（688035）发生大宗交易成交2709.67万元
6月3日德邦科技发生1笔大宗交易 成交金额2709.67万元
证券之星 · 06-03
6月3日德邦科技发生1笔大宗交易 成交金额2709.67万元
每周股票复盘：XD德邦科（688035）大基金减持德邦科技1%股份
证券之星 · 05-31
每周股票复盘：XD德邦科（688035）大基金减持德邦科技1%股份
大基金，减持00981、688126、688035
滚动播报 · 05-28
大基金，减持00981、688126、688035
5月28日德邦科技发布公告，股东减持142.24万股
证券之星 · 05-28
5月28日德邦科技发布公告，股东减持142.24万股
德邦科技最新公告：股东国家集成电路基金持股比例降至11.90%
证券之星 · 05-28
德邦科技最新公告：股东国家集成电路基金持股比例降至11.90%
每周股票复盘：大基金减持德邦科技（688035）106.68万股
证券之星 · 05-24
每周股票复盘：大基金减持德邦科技（688035）106.68万股
5月19日德邦科技现3067.41万元大宗交易
证券之星 · 05-19
5月19日德邦科技现3067.41万元大宗交易
德邦科技（688035）披露持股5%以上股东权益变动触及1%刻度的提示性公告，5月18日股价上涨6.47%
证券之星 · 05-18
德邦科技（688035）披露持股5%以上股东权益变动触及1%刻度的提示性公告，5月18日股价上涨6.47%
5月18日德邦科技发生1笔大宗交易 成交金额3054.6万元
证券之星 · 05-18
5月18日德邦科技发生1笔大宗交易 成交金额3054.6万元
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公司概况
公司名称：
烟台德邦科技股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2022-09-19
主营业务：
烟台德邦科技股份有限公司的主营业务是高端电子封装材料研发及产业化。公司的主要产品是集成电路封装材料、智能终端封装材料、新能源应用材料、高端装备应用材料。公司凭借卓越的技术实力和创新能力，荣获国家专精特新重点“小巨人”企业、“国家知识产权示范企业”、“国家级制造业单项冠军企业”荣誉称号。
发行价格：
46.12
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02:36","pubTimestamp":1782585373,"startTime":"0","endTime":"0","summary":"截至2026年6月26日收盘，德邦科技报收于95.96元，较上周的103.36元下跌7.16%。来自股本股东变化：国家集成电路产业投资基金减持德邦科技149.35万股，持股比例由11.90%降至10.85%。股本股东变化6月26日德邦科技发布公告，股东国家集成电路产业投资基金股份有限公司于2026年6月3日至6月26日期间合计减持149.35万股，占公司总股本的1.05%。公司公告汇总德邦科技已完成2024年限制性股票激励计划首次授予部分第二个归属期及预留授予部分第一个归属期的股份过户登记。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026062800000673.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2646356948","title":"德邦科技：公司芯片级底部填充胶已在部分客户小批量的应用","url":"https://stock-news.laohu8.com/highlight/detail?id=2646356948","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2646356948?lang=zh_cn&edition=full","pubTime":"2026-06-26 18:12","pubTimestamp":1782468728,"startTime":"0","endTime":"0","summary":"公司芯片级underfill已有型号通过国内部分客户验证,整体上仍处于前期验证导入阶段。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026062600034581.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2646355429","title":"德邦科技(688035.SH)：国家集成电路基金6月3日至6月26日减持公司149.35万股","url":"https://stock-news.laohu8.com/highlight/detail?id=2646355429","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2646355429?lang=zh_cn&edition=full","pubTime":"2026-06-26 17:54","pubTimestamp":1782467691,"startTime":"0","endTime":"0","summary":"智通财经APP讯，德邦科技(688035.SH)发布公告，公司于2026年6月26日收到国家集成电路产业投资基金股份有限公司(简称“国家集成电路基金”)出具的《关于股东减持权益变动跨越1%的整数倍的告知函》。2026年6月3日至2026年6月26日，国家集成电路基金通过大宗交易方式减持公司股份149.35万股。国家集成电路基金持有公司股份比例由11.90%减少至10.85%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1459474.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688035","159546","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2646809586","title":"德邦科技（688035）披露2024年限制性股票激励计划归属结果公告，6月25日股价下跌2.26%","url":"https://stock-news.laohu8.com/highlight/detail?id=2646809586","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2646809586?lang=zh_cn&edition=full","pubTime":"2026-06-25 22:18","pubTimestamp":1782397102,"startTime":"0","endTime":"0","summary":"截至2026年6月25日收盘，德邦科技报收于94.1元，较前一交易日下跌2.26%，最新总市值为133.85亿元。公告显示，公司已完成2024年限制性股票激励计划首次授予部分第二个归属期及预留授予部分第一个归属期的股份过户登记。共有117名激励对象参与归属，其中首次授予部分63.70万股，预留授予部分25.00万股。中审众环会计师事务所已对激励对象出资情况进行验资，相关股份登记已于2026年6月25日完成。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026062500044083.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2643217521","title":"每周股票复盘：德邦科技（688035）现2笔大宗交易机构净买入815.8万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2643217521","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2643217521?lang=zh_cn&edition=full","pubTime":"2026-06-14 01:10","pubTimestamp":1781370623,"startTime":"0","endTime":"0","summary":"截至2026年6月12日收盘，德邦科技报收于84.69元，较上周的77.55元上涨9.21%。本周，德邦科技6月12日盘中最高价报92.7元。6月8日盘中最低价报72.04元。德邦科技当前最新总市值120.46亿元，在电子化学品板块市值排名26/34，在两市A股市值排名1646/5206。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026061400000116.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642263184","title":"德邦科技：可实现功率器件封装（含硅基IGBT、碳化硅SiC器件等）","url":"https://stock-news.laohu8.com/highlight/detail?id=2642263184","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2642263184?lang=zh_cn&edition=full","pubTime":"2026-06-12 16:00","pubTimestamp":1781251250,"startTime":"0","endTime":"0","summary":"证券之星消息，德邦科技(688035)06月12日在投资者关系平台上答复投资者关心的问题。投资者提问：请问德邦科技有产品应用于碳化硅、IGBT及功率器件的封装吗？德邦科技回复：尊敬的投资者，您好，公司主营高端电子封装材料，可实现结构粘接、导电、导热、绝缘、保护、电磁屏蔽等复合功能，是一类关键的封装装联功能性材料，广泛应用于晶圆加工、芯片级封装、功率器件封装（含硅基IGBT、碳化硅SiC器件等）、板级封装、模组及系统集成封装等不同封装工艺环节和应用场景。感谢您的关注，谢谢！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026061200023044.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642263924","title":"德邦科技：芯片级封装材料固晶系列、UV膜系列、导热系列、芯片级底部填充胶（Underfill）、Lid 框粘接材料（AD胶）均可应用在储存芯片领域","url":"https://stock-news.laohu8.com/highlight/detail?id=2642263924","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2642263924?lang=zh_cn&edition=full","pubTime":"2026-06-12 16:00","pubTimestamp":1781251249,"startTime":"0","endTime":"0","summary":"德邦科技回复：尊敬的投资者，您好，公司芯片级封装材料固晶系列、UV膜系列、导热系列、芯片级底部填充胶、Lid 框粘接材料（AD胶）均可应用在储存芯片领域；公司导热系列材料和EMI电磁屏蔽材料可用于光模块领域，起到导热、电磁屏蔽、吸波等作用，可用于共封装光学场景；公司导热垫片、SMT贴片胶、板级底部填充胶、共型覆膜等产品可用于印制电路板封装工艺中，起到结构粘接、保护、导热、导电等作用；感谢您的关注，谢谢！","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026061200023041.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159813","688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642427544","title":"6月10日德邦科技现2笔大宗交易 机构净买入815.8万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2642427544","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2642427544?lang=zh_cn&edition=full","pubTime":"2026-06-10 17:43","pubTimestamp":1781084624,"startTime":"0","endTime":"0","summary":"证券之星消息，6月10日德邦科技发生大宗交易，交易数据如下：近三个月该股共发生9笔大宗交易，合计成交3.53万手，折价成交9笔。该股近期无解禁股上市。截至2026年6月10日收盘，德邦科技(688035)报收于82.07元，上涨4.15%，换手率5.56%，成交量7.91万手，成交额6.43亿元。该股近半年内有股东持股变动，合计净减持394.54万股，股东增减持明细如下表：该股最近90天内共有2家机构给出评级，买入评级1家，增持评级1家。本文数据来源于上海证券交易所大宗交易信息披露，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026061000031533.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642212466","title":"6月9日德邦科技发生1笔大宗交易 成交金额2785.41万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2642212466","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2642212466?lang=zh_cn&edition=full","pubTime":"2026-06-09 17:48","pubTimestamp":1780998504,"startTime":"0","endTime":"0","summary":"证券之星消息，6月9日德邦科技发生大宗交易，交易数据如下：大宗交易成交价格78.33元，相对当日收盘价折价0.6%，成交35.56万股，成交金额2785.41万元，买方营业部为方正证券股份有限公司总部，卖方营业部为中信证券股份有限公司深圳科技园证券营业部。近三个月该股共发生7笔大宗交易，合计成交3.18万手，折价成交7笔。截至2026年6月9日收盘，德邦科技报收于78.8元，上涨6.8%，换手率3.67%，成交量5.22万手，成交额4.02亿元。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026060900029224.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2641212781","title":"每周股票复盘：德邦科技（688035）发生大宗交易成交2709.67万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2641212781","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2641212781?lang=zh_cn&edition=full","pubTime":"2026-06-07 02:02","pubTimestamp":1780768937,"startTime":"0","endTime":"0","summary":"截至2026年6月5日收盘，德邦科技（688035）报收于77.55元，较上周的75.71元上涨2.43%。本周，德邦科技6月5日盘中最高价报79.99元。6月2日盘中最低价报72.5元。德邦科技当前最新总市值110.31亿元，在电子化学品板块市值排名27/34，在两市A股市值排名1809/5206。本周关注点来自交易信息汇总：6月3日德邦科技发生1笔大宗交易，成交金额2709.67万元交易信息汇总6月3日德邦科技发生1笔大宗交易，成交金额2709.67万元以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），仅供参考不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026060700000532.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2640690811","title":"6月3日德邦科技发生1笔大宗交易 成交金额2709.67万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2640690811","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2640690811?lang=zh_cn&edition=full","pubTime":"2026-06-03 17:43","pubTimestamp":1780479801,"startTime":"0","endTime":"0","summary":"证券之星消息，6月3日德邦科技发生大宗交易，交易数据如下：大宗交易成交价格76.2元，相对当日收盘价折价0.59%，成交35.56万股，成交金额2709.67万元，买方营业部为方正证券股份有限公司总部，卖方营业部为中信证券股份有限公司深圳科技园证券营业部。近三个月该股共发生6笔大宗交易，合计成交2.82万手，折价成交6笔。截至2026年6月3日收盘，德邦科技报收于76.65元，上涨2.36%，换手率4.56%，成交量6.49万手，成交额5.02亿元。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026060300036110.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2639601934","title":"每周股票复盘：XD德邦科（688035）大基金减持德邦科技1%股份","url":"https://stock-news.laohu8.com/highlight/detail?id=2639601934","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2639601934?lang=zh_cn&edition=full","pubTime":"2026-05-31 01:29","pubTimestamp":1780162150,"startTime":"0","endTime":"0","summary":"截至2026年5月29日收盘，XD德邦科报收于75.71元，较上周的84.26元下跌10.15%。本周，XD德邦科5月26日盘中最高价报96.8元，股价触及近一年最高点。股本股东变化股东增减持5月28日，德邦科技股东国家集成电路产业投资基金股份有限公司披露权益变动公告，2026年5月19日至5月28日期间，通过集中竞价和大宗交易方式合计减持公司股份1,422,400股，占总股本的1.0%，持股比例从12.90%下降至11.90%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026053100000220.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2638769678","title":"大基金，减持00981、688126、688035","url":"https://stock-news.laohu8.com/highlight/detail?id=2638769678","media":"滚动播报","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2638769678?lang=zh_cn&edition=full","pubTime":"2026-05-28 21:13","pubTimestamp":1779973980,"startTime":"0","endTime":"0","summary":" 大家好啊，今晚国家大基金出现了三条减持消息。 5月28日晚间，据港交所文件披露，国家集成电路产业投资基金股份有限公司对中芯国际的多头持仓比例于2026年5月26日从8.08%降至7.99%。2026年5月19日至2026年5月28日，国家集成电路产业投资基金股份有限公司通过集中竞价及大宗交易方式合计减持公司股份1422400股，其中通过集中竞价方式减持711200股，通过大宗交易方式减持711200股。 公告称，本次权益变动属于履行此前已披露的减持股份计划。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/wm/2026-05-28/doc-inhznkuf9962738.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK0214","00981","BK1526","BK1163","BK1614","688035","BK1607","688981","BK1610","688126"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2638968966","title":"5月28日德邦科技发布公告，股东减持142.24万股","url":"https://stock-news.laohu8.com/highlight/detail?id=2638968966","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2638968966?lang=zh_cn&edition=full","pubTime":"2026-05-28 21:01","pubTimestamp":1779973261,"startTime":"0","endTime":"0","summary":"证券之星消息，5月28日德邦科技发布公告《德邦科技:烟台德邦科技股份有限公司关于持股5%以上股东权益变动触及1%刻度的提示性公告》，其股东国家集成电路产业投资基金股份有限公司于2026年5月19日至2026年5月28日间合计减持142.24万股，占公司目前总股本的1.0%，变动期间该股股价下跌3.18%，截止5月28日收盘报83.75元。股东增减持详情见下表：根据德邦科技2026年一季报公布的十大股东详情如下：以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052800041551.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2638766040","title":"德邦科技最新公告：股东国家集成电路基金持股比例降至11.90%","url":"https://stock-news.laohu8.com/highlight/detail?id=2638766040","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2638766040?lang=zh_cn&edition=full","pubTime":"2026-05-28 19:29","pubTimestamp":1779967770,"startTime":"0","endTime":"0","summary":"德邦科技(688035.SH)公告称，公司持股5%以上股东国家集成电路产业投资基金股份有限公司于2026年5月19日至5月28日通过集中竞价及大宗交易方式合计减持公司股份142.24万股，持股比例由12.90%降至11.90%，触及1%整数倍。本次减持属于此前披露的减持计划，不触及强制要约收购义务，不会导致公司控股股东及实际控制人变化。以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052800037937.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159546","688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637137844","title":"每周股票复盘：大基金减持德邦科技（688035）106.68万股","url":"https://stock-news.laohu8.com/highlight/detail?id=2637137844","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637137844?lang=zh_cn&edition=full","pubTime":"2026-05-24 01:41","pubTimestamp":1779558071,"startTime":"0","endTime":"0","summary":"截至2026年5月22日收盘，德邦科技报收于84.26元，较上周的81.24元上涨3.72%。来自股本股东变化：国家集成电路产业投资基金减持106.68万股，持股比例由13.65%降至12.90%。交易信息汇总5月19日德邦科技出现3067.41万元大宗交易。5月18日德邦科技发生1笔大宗交易，成交金额为3054.6万元。股本股东变化股东增减持国家集成电路产业投资基金股份有限公司于2026年5月14日至5月18日合计减持德邦科技股份106.68万股，占公司总股本的0.75%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052400000278.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2636834982","title":"5月19日德邦科技现3067.41万元大宗交易","url":"https://stock-news.laohu8.com/highlight/detail?id=2636834982","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2636834982?lang=zh_cn&edition=full","pubTime":"2026-05-19 17:27","pubTimestamp":1779182827,"startTime":"0","endTime":"0","summary":"证券之星消息，5月19日德邦科技发生大宗交易，交易数据如下：大宗交易成交价格86.26元，相对当日收盘价折价0.67%，成交35.56万股，成交金额3067.41万元，买方营业部为中信建投证券股份有限公司总部，卖方营业部为中信证券股份有限公司深圳科技园证券营业部。近三个月该股共发生3笔大宗交易，合计成交2.11万手，折价成交3笔。截至2026年5月19日收盘，德邦科技报收于86.84元，上涨0.39%，换手率6.52%，成交量9.28万手，成交额7.92亿元。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026051900031381.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688035","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2636071484","title":"德邦科技（688035）披露持股5%以上股东权益变动触及1%刻度的提示性公告，5月18日股价上涨6.47%","url":"https://stock-news.laohu8.com/highlight/detail?id=2636071484","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2636071484?lang=zh_cn&edition=full","pubTime":"2026-05-18 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17:26","pubTimestamp":1779096393,"startTime":"0","endTime":"0","summary":"证券之星消息，5月18日德邦科技发生大宗交易，交易数据如下：大宗交易成交价格85.9元，相对当日收盘价折价0.69%，成交35.56万股，成交金额3054.6万元，买方营业部为方正证券股份有限公司总部，卖方营业部为中信证券股份有限公司深圳科技园证券营业部。近三个月该股共发生2笔大宗交易，合计成交1.76万手，折价成交2笔。截至2026年5月18日收盘，德邦科技报收于86.5元，上涨6.47%，换手率10.15%，成交量14.43万手，成交额12.75亿元。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026051800025437.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688035"],"isVideo":false,"video":null,"gpt_icon":0}],"profile":{"ret":0,"serverTime":1783134864388,"stockEarnings":[{"period":"1week","weight":-0.0818},{"period":"1month","weight":0.1495},{"period":"3month","weight":0.6686},{"period":"6month","weight":0.8294},{"period":"1year","weight":1.2221},{"period":"ytd","weight":0.8294}],"compareEarnings":[{"period":"1week","weight":0.0041},{"period":"1month","weight":-0.0099},{"period":"3month","weight":0.0421},{"period":"6month","weight":0.0188},{"period":"1year","weight":0.1683},{"period":"ytd","weight":0.0188}],"compareStock":{"symbol":"000001.SH","name":"上证指数"},"companyName":"烟台德邦科技股份有限公司","boardCode":"AI0039","boardName":"计算机、通信和其他电子设备制造业","stockholders":"12470人(较上一季度增加7.56%)","perCapita":"11406股","listingDate":"2022-09-19","address":"山东省烟台市福山区经济技术开发区开封路3-3号(C-41小区)","registeredCapital":"14224万元","survey":" 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