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玻璃不是硅吗

异动解读 | 玻璃封装新技术推动半导体ETF大涨

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height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n异动解读 | 玻璃封装新技术推动半导体ETF大涨\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1092702339\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/a81accab1e7ee4144dc051f71903a390);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">异动解读 </p>\n<p class=\"h-time\">2024-10-30 00:20</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>今日,三倍做多半导体ETF盘中大涨5.01%,引发市场广泛关注。分析人士认为,这与近期半导体行业新兴封装技术的进展密切相关。</p>\n\n<p>摩根士丹利最新报告指出,在摩尔定律放缓的背景下,半导体行业正在加大对先进封装技术的投入,其中利用玻璃材料进行封装日渐受到重视。与现有硅晶圆相比,玻璃基底可提供更大尺寸、更佳电性能、可调整的热膨胀系数等优势,有望带来20%-30%的成本节约。</p>\n\n<p>多家大型芯片公司和供应商如英特尔、台积电、美光等已逐步布局玻璃封装技术。虽然目前仍存在一些技术挑战需要克服,但分析人士预计未来几年该市场将快速增长。据估计,到2028年玻璃扇出式面板级封装市场规模将达到2.52亿美元。</p>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"SOXL":"三倍做多半导体ETF-Direxion Daily"},"source_url":"","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1163892962","content_text":"今日,三倍做多半导体ETF盘中大涨5.01%,引发市场广泛关注。分析人士认为,这与近期半导体行业新兴封装技术的进展密切相关。\n摩根士丹利最新报告指出,在摩尔定律放缓的背景下,半导体行业正在加大对先进封装技术的投入,其中利用玻璃材料进行封装日渐受到重视。与现有硅晶圆相比,玻璃基底可提供更大尺寸、更佳电性能、可调整的热膨胀系数等优势,有望带来20%-30%的成本节约。\n多家大型芯片公司和供应商如英特尔、台积电、美光等已逐步布局玻璃封装技术。虽然目前仍存在一些技术挑战需要克服,但分析人士预计未来几年该市场将快速增长。据估计,到2028年玻璃扇出式面板级封装市场规模将达到2.52亿美元。","news_type":1},"isVote":1,"tweetType":1,"viewCount":31,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":12,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/365673504174320"}