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TrendForce 发布报告指出，供应链看好 GB200AI 芯片2025 年出货量突破百万颗

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年出货量突破百万颗","highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/320258323955992","repostId":2445045016,"repostType":2,"repost":{"id":"2445045016","pubTimestamp":1719212880,"share":"https://www.laohu8.com/m/news/2445045016?lang=&edition=full","pubTime":"2024-06-24 15:08","market":"us","language":"zh","title":"消息称英伟达 GB200 AI 芯片供不应求，追单日月光、京元电等封测厂","url":"https://stock-news.laohu8.com/highlight/detail?id=2445045016","media":"IT之家","summary":"台媒经济日报消息，英伟达全新 GB200 系列 AI 芯片供不应求，英伟达向台积电追加先进制程投片量后，又向后段封测厂追单，日月光、京元电第四季度相关订单量将环比增长一倍。消息人士透露，京元电来自英伟达的新增订单“爆满”，京元电内部为此进行了总动员，挪移更多产能以满足英伟达需求。TrendForce 发布报告指出，供应链看好 GB200AI 芯片2025 年出货量突破百万颗，且由于测试时间大幅增加，日月光和京元电将成为后段封测的“两大赢家”。","content":"<html><body><div>\n<p>台媒经济日报消息，<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>全新 GB200 系列 AI 芯片供不应求，英伟达向<a href=\"https://laohu8.com/S/TSM\">台积电</a>追加先进制程投片量后，又向后段封测厂追单，日月光、京元电第四季度相关订单量将环比增长一倍。</p><p>据IT之家此前报道，GB200 芯片发布于 3 月 19 日，由两个 B200 Blackwell GPU 和一个基于 Arm 的 Grace CPU 组成，推理大语言模型性能比 H100 提升 30倍，成本和能耗降至 25 分之一。</p><p>日月光旗下的硅品与英伟达关系密切，不仅承接台积电 CoWoS 先进封装的 oS 段制程，也在中科厂布局测试产能，满足英伟达从晶圆后段到封测段的一条龙式生产服务。</p><p>京元电回应称，现阶段产能利用率确实高，但对单一客户不予置评。消息人士透露，京元电来自英伟达的新增订单“爆满”，京元电内部为此进行了总动员，挪移更多产能以满足英伟达需求。</p><p>业界分析，GB200 与 B 系列 AI 芯片测试流程较前一代 H 系列大幅拉长，必须连续经过四道程序，包括终端测试（Final Test）、Burn-in 老化测试、再回到终端测试，最终才进行 SLT 系统级测试。</p><p>TrendForce 发布报告指出，供应链看好 GB200AI 芯片2025 年出货量突破百万颗，且由于测试时间大幅增加，日月光和京元电将成为后段封测的“两大赢家”。</p>\n<div>\n<div>\r\n            责任编辑：钟离\r\n          </div>\n</div>\n</div></body></html>","source":"jinrongjie_highlight","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>消息称英伟达 GB200 AI 芯片供不应求，追单日月光、京元电等封测厂</title>\n<style 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href=\"https://usstock.jrj.com.cn/2024/06/24150841160274.shtml\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"159813":"芯片","LU0238689110.USD":"贝莱德环球动力股票基金","LU0170899867.USD":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","BK4588":"碎股","BK4550":"红杉资本持仓","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","IE00B19Z9505.USD":"美盛-美国大盘成长股A Acc","BK4141":"半导体产品","BK4503":"景林资产持仓","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0079474960.USD":"联博美国增长基金A","LU0056508442.USD":"贝莱德世界科技基金A2","IE00B1XK9C88.USD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A\" (USD) ACC","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","LU0308772762.SGD":"Blackrock Global Allocation A2 SGD-H","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G 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芯片发布于 3 月 19 日，由两个 B200 Blackwell GPU 和一个基于 Arm 的 Grace CPU 组成，推理大语言模型性能比 H100 提升 30倍，成本和能耗降至 25 分之一。日月光旗下的硅品与英伟达关系密切，不仅承接台积电 CoWoS 先进封装的 oS 段制程，也在中科厂布局测试产能，满足英伟达从晶圆后段到封测段的一条龙式生产服务。京元电回应称，现阶段产能利用率确实高，但对单一客户不予置评。消息人士透露，京元电来自英伟达的新增订单“爆满”，京元电内部为此进行了总动员，挪移更多产能以满足英伟达需求。业界分析，GB200 与 B 系列 AI 芯片测试流程较前一代 H 系列大幅拉长，必须连续经过四道程序，包括终端测试（Final Test）、Burn-in 老化测试、再回到终端测试，最终才进行 SLT 系统级测试。TrendForce 发布报告指出，供应链看好 GB200AI 芯片2025 年出货量突破百万颗，且由于测试时间大幅增加，日月光和京元电将成为后段封测的“两大赢家”。\n\n\r\n            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