英特尔再受重击：AMD联合台积电，2nm芯片已来

Ofweek维科网2025-04-17

在芯片行业的江湖中，英特尔与AMD的缠斗持续了半个多世纪。曾经的“老大哥”与“小跟班”，如今却因技术路线的分野，上演了一场残酷的攻守互换。而随着AMD宣布联合台积电推出2nm芯片，这场竞争的天平似乎再次倾斜。历史恩怨：从“小弟”到挑战者上世纪80年代，英特尔凭借x86架构的专利壁垒，几乎垄断了全球PC处理器市场。彼时的AMD，更像是英特尔为规避反垄断风险而刻意保留的“陪跑者”——技术授权、产品迭代...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025041714104394d859ae&s=b><strong>Ofweek维科网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>在芯片行业的江湖中，英特尔与AMD的缠斗持续了半个多世纪。曾经的“老大哥”与“小跟班”，如今却因技术路线的分野，上演了一场残酷的攻守互换。而随着AMD宣布联合台积电推出2nm芯片，这场竞争的天平似乎再次倾斜。历史恩怨：从“小弟”到挑战者上世纪80年代，英特尔凭借x86架构的专利壁垒，几乎垄断了全球PC处理器市场。彼时的AMD，更像是英特尔为规避反垄断风险而刻意保留的“陪跑者”——技术授权、产品迭代...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025041714104394d859ae&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2089283258.USD","symbol_name":"安联环球可持续基金Cl AM 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GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","BK4548":"巴美列捷福持仓"},"translate_title":"Intel takes another heavy blow: AMD joins forces with TSMC, 2nm chips are here","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSM":1,"AMD":1,"INTC":1,"03145":0.6,"GFS":1},"content_text":"在芯片行业的江湖中，英特尔与AMD的缠斗持续了半个多世纪。曾经的“老大哥”与“小跟班”，如今却因技术路线的分野，上演了一场残酷的攻守互换。而随着AMD宣布联合台积电推出2nm芯片，这场竞争的天平似乎再次倾斜。历史恩怨：从“小弟”到挑战者上世纪80年代，英特尔凭借x86架构的专利壁垒，几乎垄断了全球PC处理器市场。彼时的AMD，更像是英特尔为规避反垄断风险而刻意保留的“陪跑者”——技术授权、产品迭代，始终活在巨头的阴影之下。但商业世界的剧本从不乏反转。2006年，AMD凭借“真双核”架构短暂压制英特尔；2017年，锐龙（Ryzen）处理器的横空出世，更是撕开了英特尔长期把持的高性能市场缺口。不过，真正让双方地位发生质变的，是制造工艺的分道扬镳。战略分水岭：代工模式 vs 垂直整合英特尔曾以“IDM模式”（设计+制造一体化）为傲，从芯片设计到晶圆生产全流程自主掌控。然而，自10nm工艺屡屡跳票开始，这家巨头逐渐陷入“制程延迟—工艺拉跨—客户流失”的恶性循环。反观AMD，在2018年剥离格芯（GlobalFoundries）后，轻装上阵转型为纯设计公司（Fabless），将制造环节全权委托给台积电。这一决策看似被动，实则暗藏杀机：台积电的先进制程（7nm、5nm）迅速成为AMD反超的跳板。2023年，AMD在服务器芯片市场的份额已突破30%，而英特尔则因产能问题屡遭客户抱怨。“绑定台积电，是AMD近十年最明智的选择。” 一位行业分析师直言，“当英特尔还在为10nm工艺发愁时，AMD已经吃透了5nm的红利。”2nm芯片落地：AMD的“技术突袭”而近日，AMD的一则官宣引发行业震动：与台积电合作的2nm核心复合芯片（CCD），将搭载于第六代EPYC “Venice”服务器处理器，明年会推出。这意味着，AMD不仅抢下了“首发2nmCPU”的头衔，更验证了台积电N2工艺的成熟度。“AMD的路线图比英特尔进步至少两年。” 一名服务器厂商采购负责人透露，“客户们已经开始讨论Venice的测试订单，而英特尔的18A工艺，可能还在PPT上。”英特尔困局：18A工艺的迷雾面对AMD的步步紧逼，英特尔将翻盘的希望押注于18A工艺。官方宣称，这一制程将在2025年量产，性能媲美台积电2nm。但业界质疑声不断：技术可行性：英特尔此前多次承诺的制程节点（如10nm、7nm）均大幅延期，18A的“画饼”可信度存疑；客户信任：苹果、英伟达等大客户早已转向台积电，即便18A如期量产，能否挽回流失的订单仍是未知数；资金压力：新建晶圆厂需耗资数百亿美元，而英特尔2024年业绩很差，现金流捉襟见肘。“英特尔陷入了‘既要追赶制程，又要维持IDM模式’的双重陷阱。”半导体研究机构TechInsights评论称，“它的对手不仅是AMD，更是整个代工模式的效率碾压。”芯片江湖：没有永远的“大哥”回望芯片产业史，技术路线的选择往往比短期市场份额更具决定性。AMD与台积电的结盟，本质上是“专业分工”对“垂直整合”的胜利——设计公司专注创新，代工厂极致打磨工艺，二者协同形成的效率优势，已非传统IDM巨头所能匹敌。而对英特尔而言，教训或许更为深刻：当一家公司既要扮演“运动员”（设计芯片），又要兼任“裁判员”（控制制造），其决策难免因内部利益纠葛而失衡。制程落后的根源，或许不在于技术能力，而在于对旧模式的路径依赖。你怎么看？英特尔还能扳回这一局吗？原文标题 : 英特尔再受重击：AMD联合台积电，2nm芯片已来","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-2","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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