马来西亚与软银旗下Arm签署2.5亿美元协议以支持该国半导体行业

新浪财经2025-03-06

马来西亚已与英国芯片设计公司Arm Holdings达成协议，以使用后者的先进技术。这个东南亚国家正寻求加强其在半导体上游供应链中的作用，并向高科技产业转型。周三，马来西亚签署了一项协议，将在10年内向软银集团旗下的Arm支付2.5亿美元，以获得知识产权授权，涵盖七个计算子系统和Arm Flexible Access计划。预计该协议将推动马来西亚实现生产先进制程芯片的目标。马来西亚的半导体行业传统...

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马来西亚与软银旗下Arm签署2.5亿美元协议 以支持该国半导体行业

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马来西亚与软银旗下Arm签署2.5亿美元协议以支持该国半导体行业