半导体业并购热潮涌动，企业加速构筑新竞争优势

中国家电网2025-03-06

在政策利好的驱动下，半导体行业的并购活动持续升温。近期，惠州光弘科技股份有限公司(光弘科技)、有研半导体硅材料股份公司(有研硅)、TCL科技集团股份有限公司(TCL科技)及深圳英集芯科技股份有限公司(英集芯)等多家上市公司纷纷公布了并购计划，这一系列动作标志着半导体企业正加速通过并购构建新的竞争优势。在半导体行业中，拓宽业务布局和技术储备是企业并购的重要驱动力。例如，有研硅计划通过支付现金方式收购...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2517390365?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-03-06 10:12","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2517390365","market":"sh","top_or_hot":-1,"title":"半导体业并购热潮涌动，企业加速构筑新竞争优势","media":"中国家电网","content":"<div>\n<p>在政策利好的驱动下，半导体行业的并购活动持续升温。近期，惠州光弘科技股份有限公司(光弘科技)、有研半导体硅材料股份公司(有研硅)、TCL科技集团股份有限公司(TCL科技)及深圳英集芯科技股份有限公司(英集芯)等多家上市公司纷纷公布了并购计划，这一系列动作标志着半导体企业正加速通过并购构建新的竞争优势。在半导体行业中，拓宽业务布局和技术储备是企业并购的重要驱动力。例如，有研硅计划通过支付现金方式收购...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250306102228963b8716&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>半导体业并购热潮涌动，企业加速构筑新竞争优势</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n半导体业并购热潮涌动，企业加速构筑新竞争优势\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-03-06 10:12 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250306102228963b8716&s=b><strong>中国家电网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>在政策利好的驱动下，半导体行业的并购活动持续升温。近期，惠州光弘科技股份有限公司(光弘科技)、有研半导体硅材料股份公司(有研硅)、TCL科技集团股份有限公司(TCL科技)及深圳英集芯科技股份有限公司(英集芯)等多家上市公司纷纷公布了并购计划，这一系列动作标志着半导体企业正加速通过并购构建新的竞争优势。在半导体行业中，拓宽业务布局和技术储备是企业并购的重要驱动力。例如，有研硅计划通过支付现金方式收购...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250306102228963b8716&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"600745","symbol_name":"闻泰科技","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250306102228963b8716&s=b","article_id":"2517390365","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250306102228963b8716&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2517390365","pubTimestamp":1741227120,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"在政策利好的驱动下，半导体行业的并购活动持续升温。近期，惠州光弘科技股份有限公司、有研半导体硅材料股份公司(有研硅)、TCL科技集团股份有限公司及深圳英集芯科技股份有限公司(英集芯)等多家上市公司纷纷公布了并购计划，这一系列动作标志着半导体企业正加速通过并购构建新的竞争优势。在半导体行业中，拓宽业务布局和技术储备是企业并购的重要驱动力。半导体行业的并购热潮正在加速企业的转型升级和竞争力提升。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"561980":"半导体设备ETF","600171":"上海贝岭","600206":"有研新材","600460":"士兰微","600584":"长电科技","600745":"闻泰科技","600877":"电科芯片","603005":"晶方科技","603061":"金海通","603068":"博通集成","603160":"汇顶科技","603290":"斯达半导","603375":"盛景微","603501":"豪威集团","603690":"至纯科技","603893":"瑞芯微","603986":"兆易创新","688008":"澜起科技","688012":"中微公司","688018":"乐鑫科技","688041":"海光信息","688045":"必易微","688047":"龙芯中科","688048":"长光华芯","688052":"纳芯微","688061":"灿瑞科技","688072":"拓荆科技","688082":"盛美上海","688110":"东芯股份","688120":"华海清科","688130":"晶华微","688138":"清溢光电","688153":"唯捷创芯","688167":"炬光科技","688172":"燕东微","688173":"希荻微","688216":"气派科技","688233":"神工股份","688249":"晶合集成","688252":"天德钰","688259":"创耀科技","688261":"东微半导","688279":"峰岹科技","688325":"赛微微电","688352":"颀中科技","688361":"中科飞测","688362":"甬矽电子","688381":"帝奥微","688396":"华润微","688401":"路维光电","688409":"富创精密","688416":"恒烁股份","688419":"耐科装备","688449":"联芸科技","688458":"美芯晟","688478":"晶升股份","688486":"龙迅股份","688498":"源杰科技","688508":"芯朋微","688530":"欧莱新材","688536":"思瑞浦","688582":"芯动联科","688584":"上海合晶","688595":"芯海科技","688601":"力芯微","688605":"先锋精科","688608":"恒玄科技","688620":"安凯微","688652":"京仪装备","688689":"银河微电","688693":"锴威特","688711":"宏微科技","688720":"艾森股份","688721":"龙图光罩","688728":"格科微","688766":"普冉股份","688798":"艾为电子","688981":"中芯国际"},"translate_title":"Mergers and acquisitions in the semiconductor industry are surging, and companies are accelerating to build new competitive advantages","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"561980":0.9,"600171":0.9,"600206":0.9,"600460":0.9,"600584":0.9,"600745":0.9,"600877":0.9,"603005":0.9,"603061":0.9,"603068":0.9,"603160":0.9,"603290":0.9,"603375":0.9,"603501":0.9,"603690":0.9,"603893":0.9,"603986":0.9,"688008":0.9,"688012":0.9,"688018":0.9,"688041":0.9,"688045":0.9,"688047":0.9,"688048":0.9,"688052":0.9,"688061":0.9,"688072":0.9,"688082":0.9,"688110":0.9,"688120":0.9,"688130":0.9,"688138":0.9,"688153":0.9,"688167":0.9,"688172":0.9,"688173":0.9,"688216":0.9,"688233":0.9,"688249":0.9,"688252":0.9,"688259":0.9,"688261":0.9,"688279":0.9,"688325":0.9,"688352":0.9,"688361":0.9,"688362":0.9,"688381":0.9,"688396":0.9,"688401":0.9,"688409":0.9,"688416":0.9,"688419":0.9,"688449":0.9,"688458":0.9,"688478":0.9,"688486":0.9,"688498":0.9,"688508":0.9,"688530":0.9,"688536":0.9,"688582":0.9,"688584":0.9,"688595":0.9,"688601":0.9,"688605":0.9,"688608":0.9,"688620":0.9,"688652":0.9,"688689":0.9,"688693":0.9,"688711":0.9,"688720":0.9,"688721":0.9,"688728":0.9,"688766":0.9,"688798":0.9,"688981":0.9},"content_text":"在政策利好的驱动下，半导体行业的并购活动持续升温。近期，惠州光弘科技股份有限公司(光弘科技)、有研半导体硅材料股份公司(有研硅)、TCL科技集团股份有限公司(TCL科技)及深圳英集芯科技股份有限公司(英集芯)等多家上市公司纷纷公布了并购计划，这一系列动作标志着半导体企业正加速通过并购构建新的竞争优势。在半导体行业中，拓宽业务布局和技术储备是企业并购的重要驱动力。例如，有研硅计划通过支付现金方式收购高频(北京)科技股份有限公司约60%的股权，此举旨在促进双方在客户渠道方面的协同合作，增强产业协同，为未来丰富公司业务布局和提升核心竞争力奠定基础。同时，光弘科技则拟斥资7.33亿元购买All Circuits S.A.S.100%股权及TISCircuits SARL0.003%股权，以深化自身在汽车电子行业的技术储备。此外，TCL科技拟斥资115.62亿元收购深圳市华星光电半导体显示技术有限公司21.53%的股权，深化半导体显示主业布局;至正股份则计划通过重大资产置换、发行股份及支付现金的方式收购先进封装材料国际有限公司99.97%的股权，并置出全资子公司至正新材料100%股权，未来专注于半导体封装材料和专用设备。虽然并购活动有助于企业获得新技术和新客户，但并购后的协同发展同样重要。中国城市专家智库委员会常务副秘书长林先平表示，除了资本运作之外，并购后的整合、协同、创新和可持续发展都是企业必须考虑的关键因素。通过良好的协同发展，企业才能真正实现并购的价值，提升技术创新能力和市场竞争力，从而在市场竞争中取得更有利地位。半导体行业的并购热潮正在加速企业的转型升级和竞争力提升。未来，随着并购活动的持续深入和并购基金的助力，半导体产业有望向全球价值链中高端迈进，为经济发展注入新的活力。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2517390365","isCrawlerRequest":true}