政策东风助力，至正股份开启半导体产业新篇章

中国经营网2025-03-04

在全球半导体产业竞争白热化的当下，至正股份的跨境并购之举成为行业焦点。2月28日，至正股份（603991.SH）发布《重大资产置换、发行股份及支付现金购买资产并募集配套资金暨关联交易报告书（草案）》，拟通过“资产置换+发行股份+现金支付”组合方案，收购全球高端半导体封装材料龙头“先进封装材料国际有限公司”99.97%股权，同时引入港股半导体设备巨头ASMPT（00522.HK）成为战略股东。　　...

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作为重要股东，更有望为至正股份的经营与治理带来跨越式提升。ASMPT凭借其在行业内的深厚底蕴和广泛资源，入股后通过提名多位董事会成员深度参与公司战略决策，带来国际化的管理经验和前沿技术，助力至正股份快速融入全球半导体产业生态。这种国际化合作模式，一方面，提升了至正股份的品牌影响力和国际竞争力，同时可吸引更多国际资本和技术关注我国半导体产业，为产业发展营造良好的国际合作环境。　　为顺利推进并购、降低并购后整合难度，至正股份精心设计，通过合理估值确保交易性价比、稳定核心团队保障业务延续性、借助实控人王强的产业经验实现战略协同，为并购成功筑牢坚实防线。　　至正股份此次跨境并购的成功推进，将开启了半导体产业创新发展的新篇章。它不仅是企业自身实现跨越式发展的关键一步，更是为整个半导体产业提供了创新发展思路和合作模式，有望引领我国半导体产业在全球竞争中脱颖而出，驶向高质量发展的新征程。（文章来源：中国经营网）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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