三星封装大将，离职！

半导体行业观察01-02

据报道，三星电子为加强半导体封装能力而聘请的副总裁林俊成已离职。林副总裁是一位封装专家，曾于 1999 年至 2017 年在台积电工作。在美光和 Skytech 工作后，他被三星电子聘用，领导下一代高带宽存储器（HBM）HBM 4 封装技术的开发。此前，半导体行业曾有传言称，林副总去年年底有关于企业迁往中国大陆和台湾的未来计划。据半导体行业1日消息，半导体研究院系统封装实验室副院长林因与三星电子...

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封装技术的开发。此前，半导体行业曾有传言称，林副总去年年底有关于企业迁往中国大陆和台湾的未来计划。据半导体行业1日消息，半导体研究院系统封装实验室副院长林因与三星电子半导体（DS）部门的合同到期，于去年12月31日离职。林副总裁在他的SNS上表示：“通过应用三星先进的封装技术，3维集成电路（3DIC）、HBM 16层混合铜接合、I-CubeE、I-CubeR和共封装光学（CPO），公司和个人“我很高兴为我的职业发展做出贡献，”他说。随着摩尔定律达到极限，封装能力成为半导体行业的关键竞争优势。为此，三星电子一直在努力在2022年创建先进封装（AVP）业务团队。此次林副总的招聘，当时也被解读为拓展AVP业务的垫脚石。随后，去年5月，副会长全英贤就任DS部门负责人，AVP业务团队重组为AVP开发团队。此前报道：三星电子聘请台积电高管担任封装开发副总裁据2023年的报道，三星电子聘请林俊成担任副总裁，林俊成是一位资深工程师，曾在三星代工业务的主要竞争对手台积电工作了近19年。林的招聘旨在加快先进封装技术的发展，这家韩国芯片制造商正在积极投资这一技术。据业内人士3月8日消息，三星电子近期聘请Lin担任半导体（DS）部门先进封装业务团队副总裁。林副总裁今后将在该组织内开展先进封装技术的开发工作。林副总裁是半导体封装领域的专家，1999年至2017年在台积电工作。在此期间，他精心策划了台积电申请了450多项美国专利。林先生被认为为台积电目前擅长的 3D 封装技术奠定了基础做出了贡献。在加入台积电之前，林先生还曾在美国存储半导体公司美光科技工作。此外，在加入三星电子之前，林先生曾担任台湾半导体设备公司Skytech的首席执行官，积累了封装设备的生产经验。与台积电、英特尔等全球半导体公司相比，三星电子的先进封装投资有些晚。然而，自去年以来，这家韩国芯片制造商一直在积极建设封装基础设施并招募人才。去年，三星电子创建了一个先进封装商业化工作组，由 DS 部门总裁 Kyung Kye-hyun 直接领导。今年，该工作组升级为先进封装业务组，成为由副总裁King Moon-soo领导的常设组织。在聘请林副总裁之前，三星电子从苹果公司引进了副总裁金宇平（Kim Woo-pyung），并任命他为美国封装解决方案中心负责人，以加强人力资源。此外，三星电子代工部门还从英特尔聘请了研究先进光刻工艺极紫外技术的副总裁Lee Sang-hoon。曾在全球最大芯片设计公司高通开发自动驾驶汽车半导体的本尼·卡蒂比安 (Benny Katibian) 也跳槽至三星电子美国公司。此外，三星电子负责智能手机业务的MX部门执行董事李钟石(Lee Jong-seok)在2023年也从苹果跳槽到三星电子。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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