台积电、三星、英特尔2025年争夺量产2nm芯片

爱集微12-25 11:33

随着尖端代工厂2025年开始使用2nm工艺节点量产芯片，半导体领域正在上演一场激烈的竞争。这恰逢3nm量产的第三年。首批搭载3nm芯片的智能手机是苹果iPhone 15 Pro和iPhone 15 Pro Max，这两款手机都配备基于台积电第一代3nm节点（N3B）构建的A17 Pro应用处理（AP）。台积电第二代3nm节点（N3E）用于制造iPhone 16系列所用的A18和A18 Pro AP...

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AP，以节省费用。使用新工艺节点制造芯片所用的硅片价格通常在该节点使用的第一年更高。全球最大的晶圆代工厂台积电已经在2nm上填满“舞会牌”。除了其最大客户苹果已全部签约2026年的2nm产能外，台积电的客户如HPC（高性能计算）制造商、人工智能（AI）、芯片制造商和移动芯片制造商也都参与其中。这使得台积电在2nm订单方面领先于英特尔和三星代工厂。除了苹果，其他表示希望搭上购买台积电2nm产能的知名公司包括AMD、英伟达、联发科和高通。过去几年，三星代工厂在4nm、3nm和2nm的良率方面一直存在问题。三星代工厂在为高通生产骁龙8 Gen1时，4nm良率非常糟糕，以至于后来高通放弃三星代工，转而选择台积电。台积电制造了骁龙8+ Gen 1 AP。最终，三星代工厂将4nm 良率提高到70%。然而，三星代工厂在3nm方面仍然存在良率问题，据报道，这导致3nm Exynos 2500 AP的生产延迟。因此，三星可能不得不支付额外的资金，为所有Galaxy S25系列手机配备更昂贵的骁龙8 Elite SoC，而不是其内部的Exynos 2500。低良率会增加芯片的成本，因为需要额外的硅晶圆来制造足够的芯片来完成订单。2nm竞赛的另一个参赛者是日本创企Rapidus。该公司由日本政府资助，而日本政府本身正在与美国合作，使用IBM技术制造2nm芯片。Rapidus计划专注于小订单和定制芯片，它不会一开始就专注于通过量产芯片的订单实现盈利。IBM早在2021年5月就使用2nm节点制造了第一款芯片，甚至使用了全环绕栅极（GAA）晶体管，使用垂直放置的水平纳米片围绕通道的四面。GAA允许更好地控制驱动电流，并减少电流泄漏，可以生产更强大、更节能的芯片。与此同时，英特尔的合同代工业务是美国芯片制造商扭转局面的重要组成部分。但这是前首席执行官帕特·基辛格的计划，他曾在2021年表示，英特尔将在2025年凭借Intel 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