【郭明𫓹：苹果M5系列芯片将采用台积电N3P制程，数月前已进入原型阶段】12月23日晚间，跟踪苹果产业链多年的天风国际证券分析师郭明𫓹发文披露苹果M5系列芯片相关信息：M5系列芯片将采用台积电N3P制程，数月前已进入原型阶段，预计M5、M5 Pro/Max、M5 Ultra将分别于2025年上半年、下半年和2026年开始量产。M5 Pro、Max与Ultra将采用服务器级芯片的SoIC封装。苹果PCC基础设施建设将在高阶M5芯片量产后加速推进，因为其更适用于AI推理。

金融界12-23 23:33

12月23日晚间，跟踪苹果产业链多年的天风国际证券分析师郭明𫓹发文披露苹果M5系列芯片相关信息：M5系列芯片将采用台积电N3P制程，数月前已进入原型阶段，预计M5、M5 Pro/Max、M5 Ultra将分别于2025年上半年、下半年和2026年开始量产。M5 Pro、Max与Ultra将采用服务器级芯片的SoIC封装。苹果PCC基础设施建设将在高阶M5芯片量产后加速推进，因为其更适用于AI推理。

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TSMC's N3P process and entered the prototype stage a few months ago. It is expected that M5, M5 Pro/Max, and M5 Ultra will start mass production in the first half of 2025, the second half of 2025, and 2026 respectively. The M5 Pro, Max and Ultra will be packaged in server-on-chip SoIC packages. 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