《股市简讯》中国芯片代工商芯联集成高开2.1%，总理李强调研到访该公司

路透中文12-23 09:39

《股市简讯》中国芯片代工商<a href="https://laohu8.com/S/688469">芯联集成</a>高开2.1%，总理李强调研到访该公司

* 中国汽车电子系统芯片代工生产商--芯联集成688469.SS周一早盘高开2.1%。

* 中国国务院总理李强12月18-20号在浙江调研。新华周五刊登的新闻稿显示，他到访了芯联集成，并询问集成电路技术攻关等情况。

* 芯联集成今年迄今涨12.5%，同期沪深300指数.CSI300上扬15.1%。

* 中华交易服务半导体芯片行业指数.CSI990001盘中一度跌0.2%。（完）

更多股市简讯请点选CN-CMN-HOT

(发稿徐凯文；审校吴云凌)

((kaiwen.xu@thomsonreuters.com))

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