台积电，强攻FOPLP

半导体行业观察12-21 09:35

（原标题：台积电，强攻FOPLP）如果您希望可以时常见面，欢迎标星收藏哦~来源：内容来自经济日报，谢谢。市场传出台积电、日月光投控携手推动扇出型面板级封装（FOPLP）已有进度，传台积电将于2026年建立实验试产线，规格倾向接轨日月光投控300X300毫米规格，业界认为，有利于后续台湾半导体产业先进封装技术接轨，扩大产业发展。台积电对市场传闻没有新评论，今年6月，台积电回应研发芯片封装新技术...

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FOPLP","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSM":1,"03145":0.6},"content_text":"（原标题：台积电，强攻FOPLP）如果您希望可以时常见面，欢迎标星收藏哦~来源：内容来自经济日报，谢谢。市场传出台积电、日月光投控携手推动扇出型面板级封装（FOPLP）已有进度，传台积电将于2026年建立实验试产线，规格倾向接轨日月光投控300X300毫米规格，业界认为，有利于后续台湾半导体产业先进封装技术接轨，扩大产业发展。台积电对市场传闻没有新评论，今年6月，台积电回应研发芯片封装新技术从晶圆级转向面板级封装的议题时提到，密切关注先进封装技术发展，包含面板级封装技术。董事长魏哲家在7月的法说会上表示，持续关注扇出型面板级封装技术，不过相关技术目前还尚未成熟；他预期大约至少三年后FOPLP技术可望成熟，台积电届时可准备就绪。业界近期传出，台积电将于2026年设立扇出型面板级封装实验线，初期规格可望为300x300毫米尺寸，而非先前日本媒体传出的515x510毫米尺寸，可望直接接轨封测伙伴已有的规格，可加速生产良率，避免515x510规格衍生的切割问题，后续可因应客户需求无缝接轨到600x600毫米尺寸。台积电传出初期PLP基板尺寸定锚，全球封测龙头日月光投控也早已动起来。在布局面板级扇出型封装产品方面，先前已密集与客户、合作伙伴、设备供应商进行积极研发。日月光投控营运长吴田玉先前预估，最快2025年第2季面板级封装设备到位，日月光资深副总经理洪松井表示则说，日月光在面板级封装已布局数年，在晶圆翘曲（ warpage）控制已符合制程自动化设备规格，良率也大幅提升。吴田玉指出，日月光投入面板级封装解决方案已经五年多，从300x300毫米开始做起，一直与相当多客户合作，目前已将技术扩张至600x600毫米。“一个人的武林”前外资分析师、香港聚芯资本管理合伙人陈慧明针对2025年全球半导体及ＡＩ（人工智能）产业发展提出看法，他认为，明年仍是台积电一个人的武林，唯一的乌云可能是“白宫”，而美中贸易战无法阻挡中国大陆自建产能，这让全球半导体产业分化趋势愈来愈明显。陈慧明昨日出席“全球半导体暨ＡＩ投资展望”活动，他强调，成熟制程在大陆产能大幅增加下，明年仍然非常辛苦。此外，全球半导体产业分化趋势愈来愈明显，而且这股分化的趋势，不只是区域变化，先进制程和成熟制程也是如此。他预估，台积电明年资本支出上看三百八十亿美元，年营收增幅可达25%，其中增幅约百分之五来自英特尔大量采用先进制程，其余成长动能还是来自ＡＩ芯片。反观英特尔晶圆代工服务事业营收成长停滞、三星也呈现同样态势，台积电资本支出明年将大幅领先其他两家对手，这也代表台积电市占还会持续攀高。陈慧明预估，到了2030年时，台积电资本支出将高达七百亿美元，台积电未来营运可说没有什么乌云，“唯一的乌云是白宫”。台积电二纳米产能从十Ｋ增加到四十Ｋ时，资本支出约达两百亿美元，三星、英特尔也很难跟得上台积电。综观明年半导体产业走势，他预估明年半导体主流仍然是全球七大科技大厂，包括ＡＷＳ、Google、Meta、微软四大云端服务供应商（ＣＳＰ），以及苹果、英伟达、特斯拉三家品牌大厂。其中，四大ＣＳＰ厂明年资本支出将达两千亿美元，受惠的还是英伟达，以及台、美合作紧密的供应链，如云端服务器业者和提供代工服务的台积电。陈慧明表示，这也意味过去苹果好、台湾跟着好的模式，现在已转变为ＣＳＰ好、台湾跟着好。他说，过去半导体好就是因为苹果好，而台湾好也是因为有台积电等苹概股，因此，过去苹果好、台湾跟着好，但这两年反而会是ＣＳＰ好、台湾跟着好。ＣＳＰ资本支出扩大，代表这些业者对于ＡＩ及大语言模型投资积极，将带动台积电、辉达明年都会有不错表现，资料中心、ＡＩ服务器也会是2025年成长性较高的产业。半导体精品公众号推荐专注半导体领域更多原创内容关注全球半导体产业动向与趋势*免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。今天是《半导体行业观察》为您分享的第3982期内容，欢迎关注。‘半导体第一垂直媒体’实时 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