美股异动｜联电盘前续涨4% 消息称其拿下高通芯片先进封装大单

港股那点事12-18 17:07

联电(UMC.US)盘前续涨4%，报6.76美元。消息面上，据媒体报道，联电夺得高通高性能计算(HPC)产品的先进封装大单，预计将应用在AI PC、车用以及AI服务器市场，甚至包括HBM的整合。联电未对单一客户做出回应，但强调先进封装是公司重点发展的方向，并会与智原、硅统等子公司及存储供应伙伴华邦共同打造先进封装生态系统。(格隆汇)

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