颀中科技：电源管理芯片封装技术逐渐向先进封装迈进

每日经济新闻12-19 18:29

每经AI快讯，颀中科技近日在接待机构调研时表示，目前工业控制、汽车电子、网络通信等领域的电源管理芯片主要以传统封装为主，包括DIP、BGA、QFP/PFP、SO等封装形式。但随着下游终端需求的不断升级，尤其是以消费类电子为代表的终端对电源管理的稳定性、功耗要求和芯片尺寸要求更高，电源管理芯片封装技术逐渐从传统封装向先进封装迈进，具体包括FC 、WLCSP SiP和3D封装等形式。文章来源：每日经济...

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