消息称台积电在FOPLP(面板级扇出封装)方面初期将选择尺寸较小的300×300mm面板,预计最快2026年完成小规模产线建设。
美港电讯
12-20 20:30
消息称台积电在FOPLP(面板级扇出封装)方面初期将选择尺寸较小的300×300mm面板,预计最快2026年完成小规模产线建设。
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