消息称苹果寻求端侧 AI 性能突破，委托三星研发独立 LPDDR DRAM 封装方案

IT之家12-06

IT之家 12 月 6 日消息，韩媒 The Elec 昨日（12 月 5 日）发布博文，报道称三星应苹果公司的要求，开始研究新的低功耗双倍数据速率（LPDDR）DRAM 封装方式，从而进一步提高 iPhone 的端侧 AI 性能。堆叠封装（PoP）IT之家注：苹果 iPhone 当前采用堆叠封装（PoP）方案，LPDDR DRAM 直接堆叠在片上系统（SoC）上。这种设计自 2010 年的 ...

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href=\"https://tech.sina.cn/2024-12-06/detail-incynmey9134756.d.html?vt=4\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0149725797.USD","symbol_name":"汇丰美国股市经济规模基金","start_time":0,"source_url":"https://tech.sina.cn/2024-12-06/detail-incynmey9134756.d.html?vt=4","article_id":"2489442342","we_media_id":null,"thumbnails":["https://k.sinaimg.cn/n/spider20241206/150/w600h350/20241206/a258-488a75e308fc6cf75dd05d385a5a5822.jpg/w120h90l50t1a8a.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/2024-12-06/detail-incynmey9134756.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, 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an independent LPDDR DRAM packaging solution","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPL":1,"DRAM":1},"content_text":"IT之家 12 月 6 日消息，韩媒 The Elec 昨日（12 月 5 日）发布博文，报道称三星应苹果公司的要求，开始研究新的低功耗双倍数据速率（LPDDR）DRAM 封装方式，从而进一步提高 iPhone 的端侧 AI 性能。堆叠封装（PoP）IT之家注：苹果 iPhone 当前采用堆叠封装（PoP）方案，LPDDR DRAM 直接堆叠在片上系统（SoC）上。这种设计自 2010 年的 iPhone 4 以来一直沿用至今，其优势在于紧凑的结构，可以最大限度地减小设备的体积。\n\n\n\n\n然而，PoP 技术也限制了内存的带宽和数据传输速率，这对于需要高性能内存的 AI 应用来说是一个瓶颈。独立封装而最新消息称，苹果公司正委托三星公司，要求分离式封装 LPDDR DRAM，计划于 2026 年实现。通过分开封装 DRAM 和 SoC，可以增加 I/O 引脚数量，提高数据传输速率和并行数据通道数量，并改善散热性能，显著提高内存带宽并增强 iPhone 的 AI 能力。苹果曾将分离式封装用于 Mac 和 iPad 的 SoC，但后来改用了内存封装（MOP），以缩短芯片之间的距离，降低延迟和功耗。对于 iPhone 而言，采用独立内存封装可能需要对 SoC 或电池进行小型化设计，以腾出更多空间容纳内存组件。此外，这种改变也可能增加功耗和延迟。未来展望：LPDDR6-PIM 的应用三星还可能尝试为 iPhone DRAM 应用 LPDDR6-PIM（内存内置处理器）技术，该技术的数据传输速度和带宽是 LPDDR5X 的两到三倍，专为设备端 AI 设计，三星和 SK 海力士正合作推动其标准化。广告声明：文内含有的对外跳转链接（包括不限于超链接、二维码、口令等形式），用于传递更多信息，节省甄选时间，结果仅供参考，IT之家所有文章均包含本声明。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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