又一个12英寸晶圆厂开工！

市场资讯12-05

12月4日消息，荷兰半导体企业恩智浦 NXP 与台湾地区特殊制程代工厂商世界先进 VIS 双方合资（股权比例为 4:6）公司 VSMC 今日在新加坡淡滨尼举行其首座晶圆厂的动土典礼。该 12 英寸晶圆厂将于 2027 年开始量产，2029 年月产能预计将达 5.5 万片十二寸晶圆，可创造约 1500 个工作机会。在首座晶圆厂成功量产后，世界先进及恩智浦两方将考量未来业务发展，评估建造第二座晶圆厂。...

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的董事长方略表示：新加坡不仅是亚洲的经济枢纽，更是科技创新的高地，我们在新加坡兴建公司首座十二寸晶圆厂，将延续公司核心经营理念，提供特殊积体电路晶圆制造的专业服务，并为我们未来的发展奠定坚实基础。这座新厂不仅将为半导体产业做出贡献，更将为当地高科技产业注入强劲动能。此座晶圆厂的设计融入了现代科技和绿色制造理念，代表我们对未来的坚定承诺，VSMC 将致力成为一个负责任的企业公民，在促进经济发展的同时，也兼顾环境永续。恩智浦总裁兼首席执行官 Kurt Sievers 表示：非常高兴看到 VSMC 十二英寸晶圆厂的建设迅速推进。恩智浦在新加坡拥有数十年成功的半导体制造营运经验，新的 VSMC 晶圆厂与恩智浦的具差异化的混合式制造策略完全相符。这家新晶圆厂将为恩智浦成长计划确保一个具有成本竞争力、供应链控制力和地理韧性的制造基地。相关信息：今年6月5日，世界先进和恩智浦半导体（NXP Semiconductors）宣布计划于新加坡共同成立VisionPower Semiconductor Manufacturing Company（VSMC）合资公司，以兴建一座12英寸（300mm）晶圆厂。该晶圆厂投资约78亿美元（约合567.2784亿元人民币），世界先进将注资24亿美元持有60%股权，恩智浦将注资16亿美元持有40%股权。同年9月4日，在获得相关部门的批准后，两家公司按计划完成了注资，VSMC合资公司正式成立。VSMC的成立标志着公司在强化地理韧性、加速新加坡半导体生态系统发展方面迈出了重要一步。据悉，此晶圆厂将采用130nm至40nm的技术，生产包括混合信号、电源管理和模拟产品，以支持汽车、工业、消费类电子及移动设备等终端市场的需求，相关技术授权及技术转移预计将来自台积电。VSMC首座晶圆厂将由世界先进运营。备注：上述信息根据公开信息整理，仅供参考！重要通知：2025年4月23-25日，九峰山论坛将在武汉光谷科技会展中心再次启航，现诚挚邀请全球化合物半导体技术领域的专家学者、行业领航者及创新先锋莅临盛会，发表精彩演讲！目前招展火热进行中，好位置先到先得!~（转自：第三代半导体产业）\n\n\n海量资讯、精准解读，尽在新浪财经APP","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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