恩智浦(NXPI.US)与台积电(TSM.US)附属公司新加坡合资芯片厂破土动工

智通财经12-04

智通财经获悉，恩智浦半导体(NXPI.US)和由台积电(TSM.US)支持的世界先进积体电路股份有限公司(VIS)的合资企业VisionPower Semiconductor Manufacturing Company(VSMC)周三表示，其在新加坡投资78亿美元的工厂破土动工，并正在考虑扩张，以进一步实现全球半导体供应链的多元化。两家公司在一份声明中表示，VSMC晶圆厂的初始生产将于2027年...

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Manufacturing Company(VSMC)周三表示，其在新加坡投资78亿美元的工厂破土动工，并正在考虑扩张，以进一步实现全球半导体供应链的多元化。两家公司在一份声明中表示，VSMC晶圆厂的初始生产将于2027年...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1220541.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"TSM","symbol_name":"台积电","start_time":0,"source_url":"http://www.zhitongcaijing.com/content/detail/1220541.html","article_id":"2488195714","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2488195714","pubTimestamp":1733318767,"columns":[],"sourceInfo":{"source_id":"stock_zhitongcaijing","name":"智通财经网"},"weMediaInfo":null,"summary":"智通财经获悉，恩智浦半导体和由台积电支持的世界先进积体电路股份有限公司的合资企业VisionPower Semiconductor Manufacturing 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Sievers补充说：“恩智浦在新加坡拥有数十年成功的半导体制造业务，新的VSMC晶圆厂完全符合我们的差异化混合制造战略。这个新的晶圆厂将以具有竞争力的成本支持恩智浦的供应控制和地理弹性的增长计划。”两家公司补充说，预计到2029年，该工厂的月产量将达到5.5万片300毫米晶圆，并创造1500个就业岗位。今年6月，VIS和恩智浦宣布了在新加坡成立VSMC合资企业的计划。9月，合资企业成立。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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