消息称AMD有意跨足手机芯片领域采用台积电3nm工艺

网易新闻11-25 09:07

《科创板日报》25日讯，消息称AMD有意跨足手机芯片领域，扩大进军移动设备市场，相关新品将采用台积电3nm制程生产，助攻台积电3nm产能利用率维持超满载，订单能见度直达2026下半年。 (台湾经济日报)

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消息称AMD有意跨足手机芯片领域 采用台积电3nm工艺

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消息称AMD有意跨足手机芯片领域采用台积电3nm工艺