英伟达Blackwell芯片存在“发热问题”，引发客户担忧

华尔街见闻11-18

英伟达Blackwell芯片曝出发热问题，需要重新设计机架并可能导致客户延误。据The Information周日报道，英伟达下一代Blackwell处理器安装在高容量服务器机架时面临着过热的挑战。发热问题导致了设计变更和延迟，并引起了Google、Meta 和Microsoft等客户的担忧，他们担心自己是否能按时部署Blackwell服务器。此前，由于芯片出现设计缺陷，英伟达已不得不将...

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href=https://wallstreetcn.com/articles/3734333><strong>华尔街见闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>英伟达Blackwell芯片曝出发热问题，需要重新设计机架并可能导致客户延误。\n据The Information周日报道，英伟达下一代Blackwell处理器安装在高容量服务器机架时面临着过热的挑战。发热问题导致了设计变更和延迟，并引起了Google、Meta 和Microsoft等客户的担忧，他们担心自己是否能按时部署Blackwell服务器。 \n此前，由于芯片出现设计缺陷，英伟达已不得不将...</p>\n\n<a href=\"https://wallstreetcn.com/articles/3734333\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1852331112.SGD","symbol_name":"Blackrock World Technology Fund A2 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GPU的生产和交付推迟至少一个季度。这两起事件凸显了英伟达在满足客户对AI硬件的需求方面所面临的困难。\n新的服务器机架之所以意义重大，是因为其集成了72个英伟达 AI 芯片，预计每机架功耗高达120kW。由于过热会限制GPU性能并有损坏组件的风险，该问题导致英伟达多次重新评估其服务器机架的设计，\n针对延迟和过热问题，英伟达已指示其供应商对机架进行几项设计更改，以解决过热问题。该公司与供应商和合作伙伴密切合作，开发工程修订版以改善服务器冷却。虽然这些调整对于如此大规模的技术发布来说是标准做法，但它们仍然增加了延迟，进一步推迟了预期的发货日期。 \n高管们表示，他们至少需要几周的时间来测试系统并解决可能出现的问题，尤其是考虑到其新颖的设计和前所未有的复杂性。据一位参与设计的人士称，一些客户（如微软）计划通过更换一些组件来定制Blackwell 机架，以适应他们的数据中心。\n与此同时，客户也在考虑其他选择。一家订购了机架的云计算公司的高管表示，Blackwell的问题导致该公司考虑购买更多英伟达当前一代 Hopper 芯片。\n分析表示，客户决定购买更多Hopper芯片，可能会提高英伟达的短期收益，分析师和投资者估计 Hopper 系列的利润率更高。但这对英伟达未来的收入增长来说可能不是一个好兆头，已经转向 Hopper芯片的客户可能不会订购那么多Blackwell芯片和NVLink服务器。风险提示及免责条款\n\n            市场有风险，投资需谨慎。本文不构成个人投资建议，也未考虑到个别用户特殊的投资目标、财务状况或需要。用户应考虑本文中的任何意见、观点或结论是否符合其特定状况。据此投资，责任自负。","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"Product 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