《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级目标价82元

阿斯达克财经11-20

摩根士丹利发表研报，重新恢复对ASMPT(00522.HK) 的覆盖，给予“与大市同步”评级，目标价为82元。
该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存(HBM)市场取得突破。管理层预测第四季销售收入将按年跌3.5%至4.2亿美元，新增订单总额预期将按季持平，当中半导体业务受到先进封装的推动，预料较第三季增长，不过有部分会被季节性因素导致的主流产品销售下跌所抵销，而表面贴装技术(SMT)则预期依然受到市场持续疲软和库存消化的打击。

大摩看好ASMPT在HBM市场的热压焊接(TCB)应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。(gc/a)(港股报价延迟最少十五分钟。沽空资料截至 2024-11-19 16:25。)

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2484131893?lang=zh_CN&edition=full","thumbnail":"https://plib.aastocks.com/aafnnews/image/medialib/20220426125017323_s.jpg","is_english":false,"pubTime":"2024-11-20 11:13","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2484131893","market":"fut","top_or_hot":-1,"title":"《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级  目标价82元","media":"阿斯达克财经","content":"<html><body><div> <span> <p><a href=\"https://laohu8.com/S/MS\">摩根士丹利</a>发表研报，重新恢复对<a href=\"https://laohu8.com/S/00522\">ASMPT</a>(00522.HK)<span> </span>的覆盖，给予“与大市同步”评级，目标价为82元。<br/>该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存(HBM)市场取得突破。管理层预测第四季销售收入将按年跌3.5%至4.2亿美元，新增订单总额预期将按季持平，当中半导体业务受到先进封装的推动，预料较第三季增长，不过有部分会被季节性因素导致的主流产品销售下跌所抵销，而表面贴装技术(SMT)则预期依然受到市场持续疲软和库存消化的打击。<br/><span></span><br/>大摩看好ASMPT在HBM市场的热压焊接(TCB)应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。(gc/a)(港股报价延迟最少十五分钟。沽空资料截至 2024-11-19 16:25。)</p><div></div>AASTOCKS新闻 </span> </div></body></html>","source":"aastocks_highlight","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级  目标价82元</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级  目标价82元\n</h2>\n\n<h4 class=\"meta\">\n\n<p class=\"head\">\n<strong class=\"h-name small\">阿斯达克财经</strong><span class=\"h-time small\">2024-11-20 11:13</span>\n</p>\n\n</h4>\n\n</header>\n<article>\n<html><body><div> <span> <p><a href=\"https://laohu8.com/S/MS\">摩根士丹利</a>发表研报，重新恢复对<a href=\"https://laohu8.com/S/00522\">ASMPT</a>(00522.HK)<span> </span>的覆盖，给予“与大市同步”评级，目标价为82元。<br/>该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存(HBM)市场取得突破。管理层预测第四季销售收入将按年跌3.5%至4.2亿美元，新增订单总额预期将按季持平，当中半导体业务受到先进封装的推动，预料较第三季增长，不过有部分会被季节性因素导致的主流产品销售下跌所抵销，而表面贴装技术(SMT)则预期依然受到市场持续疲软和库存消化的打击。<br/><span></span><br/>大摩看好ASMPT在HBM市场的热压焊接(TCB)应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。(gc/a)(港股报价延迟最少十五分钟。沽空资料截至 2024-11-19 16:25。)</p><div></div>AASTOCKS新闻 </span> </div></body></html>\n\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"http://www.aastocks.com/tc/stocks/news/aafn-con/NOW.1398108/latest-news/AAFN\">阿斯达克财经</a> </p>\n\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n</div>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"00522","symbol_name":"ASMPT","start_time":0,"source_url":"http://www.aastocks.com/tc/stocks/news/aafn-con/NOW.1398108/latest-news/AAFN","article_id":"2484131893","we_media_id":null,"thumbnails":["https://plib.aastocks.com/aafnnews/image/medialib/20220426125017323_s.jpg"],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2484131893","pubTimestamp":1732072380,"sourceInfo":{"source_id":"aastocks_highlight","name":"阿思達克財經"},"weMediaInfo":null,"summary":"摩根士丹利发表研报，重新恢复对ASMPT的覆盖，给予“与大市同步”评级，目标价为82元。该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存市场取得突破。大摩看好ASMPT在HBM市场的热压焊接应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。沽空资料截至 2024-11-19 16:25。","collect":0,"end_time":0,"defaultTopTitle":"aastocks.com","property":["rate"],"viewcount":null,"language":"zh","relate_stocks":{"00522":"ASMPT"},"translate_title":"\"Big Bank\" Morgan Stanley resumes coverage of ASMPT (00522. HK) to \"keep pace with the market\" rating with a target price of 82 yuan","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"00522":1},"content_text":"摩根士丹利发表研报，重新恢复对ASMPT(00522.HK) 的覆盖，给予“与大市同步”评级，目标价为82元。该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存(HBM)市场取得突破。管理层预测第四季销售收入将按年跌3.5%至4.2亿美元，新增订单总额预期将按季持平，当中半导体业务受到先进封装的推动，预料较第三季增长，不过有部分会被季节性因素导致的主流产品销售下跌所抵销，而表面贴装技术(SMT)则预期依然受到市场持续疲软和库存消化的打击。大摩看好ASMPT在HBM市场的热压焊接(TCB)应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。(gc/a)(港股报价延迟最少十五分钟。沽空资料截至 2024-11-19 16:25。)AASTOCKS新闻","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.29.3","shortVersion":"4.29.3","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2484131893"}

《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级 目标价82元

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《大行》大摩恢复覆盖ASMPT(00522.HK)予“与大市同步”评级目标价82元