联瑞新材：间接客户为集成电路封测厂商

格隆汇11-11

（原标题：联瑞新材(688300.SH)：间接客户为集成电路封测厂商）格隆汇11月11日丨联瑞新材(688300.SH)在互动平台表示，整个集成电路的产业链包括芯片的设计、制造、封装、测试四个环节，最终将制造好的芯片交于终端客户使用。公司产品属于集成电路封装环节的上游材料，下游直接客户为环氧塑封材料（EMC）、液态塑封材料（LMC）、颗粒状塑封材料（GMC）和底部填充材料（Underfill）...

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