晶盛机电：逐步实现8-12英寸半导体大硅片设备的国产化突破

美港电讯11-04

【晶盛机电：逐步实现8-12英寸半导体大硅片设备的国产化突破】金十数据11月4日讯，晶盛机电在电话会议中表示，在半导体设备领域，公司逐步实现8-12英寸半导体大硅片设备的国产化突破，相关产品实现批量销售。在半导体行业持续复苏的发展背景下，公司原有8-12英寸大硅片设备市场进一步提升，并在功率半导体设备和先进制程设备端快速实现市场突破，公司8英寸碳化硅外延设备和光学量测设备顺利实现销售，12英寸...

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