OpenAI进行硬件战略调整：与博通合作开发其首款定制芯片

电子产品世界11-01

消息人士称，OpenAI正在与博通合作开发其首款定制芯片，用来处理庞大的人工智能计算推理的任务，并与台积电合作以确保具备芯片制造能力。OpenAI已经组建了一支约20人的芯片开发团队，其中包括曾负责构建谷歌张量处理单元（TPU）的高级工程师Thomas Norrie和Richard Ho 。但是按照目前的时间表，这款定制硬件可能要到2026年才能实现。本文引用地址：OpenAI、AMD、英伟达和...

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在英伟达芯片的基础上将AMD芯片整合到微软Azure平台中，以满足其激增的基础设施需求。AMD去年推出了MI300芯片，今年7月，AMD的数据中心业务在一年内实现了翻番增长，直追市场领头羊英伟达。此前，OpenAI考虑过内部制造，为一项建立“代工厂”的芯片制造工厂网络计划筹集资金。由于成本和时间问题，OpenAI暂时放弃了建立晶圆代工厂网络的计划，转而计划专注于内部芯片设计工作。另外众所周知，AI应用对能量的消耗十分巨大，因此开发适配自身服务的专用芯片，优化硬件与软件之间的协同作用，OpenAI的服务将会变得更加高效。其实这个策略与其他的科技公司类似，亚马逊、Meta、谷歌和微软等科技巨头都是通过结合内部研发和外部合作，确保芯片供应和控制成本。继英伟达后，博通也悄然成为该领域的另一大赢家，博通凭借其在定制芯片领域的深厚积累，近期的营收大幅攀升。花旗分析师发布报告称，继谷歌、Meta和字节跳动之后，OpenAI将成为博通的第四大ASIC（定制芯片）客户，预计博通将在明年下半年之后向OpenAI交付。值得注意的是，谷歌、微软和亚马逊在这一领域的努力已经领先了几个阶段，OpenAI可能需要大量资金才能具备真正的竞争力。今年10月，OpenAI刚完成66亿美元新一轮融资，该轮融资由Thrive Capital领投，微软、英伟达、Altimeter Capital、富达基金、软银及阿布扎比国家支持的MGX投资公司参投。","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"Company Corporation,Product 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