OpenAI大动作！自研AI芯片，预计2026年投产

智东西10-30

编译 | 汪越编辑 | 漠影智东西10月30日消息，据《路透社》报道，OpenAI正与半导体设备供应商博通（Broadcom）以及台积电（TSMC）合作，计划于2026年制造其首个定制设计芯片。目前，除了使用英伟达芯片外，OpenAI还计划通过微软云平台Azure使用AMD芯片。10月初，据《路透社》报道，OpenAI已经研究了多种实现芯片供应多样化和降低成本的策略，包括建立一个芯片制造代工厂。...

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火火兔爸
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Norrie和前谷歌TPU负责人Richard Ho。据消息人士补充，OpenAI对从英伟达挖人一直持谨慎态度，该公司希望与英伟达保持良好的关系，特别是在获得其新一代Blackwell芯片方面。英伟达拒绝置评。结语：自研芯片、寻求不同厂商合作，OpenAI努力降低成本OpenAI通过与博通、台积电合作自研芯片，并寻求与不同芯片供应商的合作，有望有效缓解芯片昂贵且短缺的局面。这一策略与亚马逊、Meta、谷歌和微软的做法类似。据消息人士透露，OpenAI预计今年将亏损50亿美元，收入为37亿美元。面对高昂的计算成本，OpenAI暂停了构建芯片代工厂的计划，转而专注于内部芯片设计，这似乎是目前最明智的决策。","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"Product Release","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[{"id":365583015760152,"gmtCreate":1730293731477,"gmtModify":1730293733423,"author":{"id":"3546249304196282","authorId":"3546249304196282","name":"火火兔爸","avatar":"https://static.tigerbbs.com/1914631c23e50a7645217a36cc9d9598","vip":1,"hat":"https://static.tigerbbs.com/b0a2963eb37c60c5d6d4a8dbcd266952","crmLevel":9,"crmLevelSwitch":1,"authorIdStr":"3546249304196282","idStr":"3546249304196282"},"htmlText":"二十个人搞毛线","listText":"二十个人搞毛线","text":"二十个人搞毛线","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/365583015760152","repostId":2479202504,"repostType":2,"repost":{"id":"2479202504","pubTimestamp":1730282192,"share":"https://www.laohu8.com/m/news/2479202504?lang=&edition=full","pubTime":"2024-10-30 17:56","market":"hk","language":"zh","title":"OpenAI大动作！自研AI芯片，预计2026年投产","url":"https://stock-news.laohu8.com/highlight/detail?id=2479202504","media":"智东西","summary":"OpenAI、AMD和台积电拒绝置评。AMD借此市场机会，预计2024年其AI芯片销售额将达到45亿美元。本次报道中，OpenAI计划采用AMD的新型MI300X芯片，通过微软云服务平台Azure使用。据消息人士透露，至少从去年开始，OpenAI就开始讨论解决公司所依赖的昂贵AI芯片短缺的问题。目前OpenAI对训练芯片的需求更大，但分析师预测，随着更多AI应用程序的部署，其对推理芯片的需求可能会超过训练芯片。据消息人士透露，OpenAI预计今年将亏损50亿美元，收入为37亿美元。","content":"<html><body><p><img src=\"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAAEAAAABAQMAAAAl21bKAAAAA1BMVEXy8vJkA4prAAAACklEQVQI12NgAAAAAgAB4iG8MwAAAABJRU5ErkJggg==\"/></p><p><strong>编译 | 汪越</strong></p><p><strong>编辑 | 漠影</strong></p><p>智东西10月30日消息，据《路透社》报道，OpenAI正与半导体设备供应商<a href=\"https://laohu8.com/S/AVGO\">博通</a>（Broadcom）以及<a href=\"https://laohu8.com/S/TSM\">台积电</a>（TSMC）合作，计划于2026年制造其首个定制设计芯片。目前，除了使用<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>芯片外，OpenAI还计划通过<a href=\"https://laohu8.com/S/MSFT\">微软</a>云平台Azure使用AMD芯片。</p><p>10月初，据《路透社》报道，OpenAI已经研究了多种实现芯片供应多样化和降低成本的策略，包括建立一个芯片制造代工厂。然而，据匿名人士透露，由于构建代工厂所需的成本和时间过高，该公司目前暂时放弃了芯片代工计划，转而专注于内部芯片设计工作。</p><p>OpenAI、AMD和台积电拒绝置评。博通没有立即回应置评请求。</p><p>目前，英伟达的芯片市占率超过80%，微软、Meta及OpenAI等都是其主要客户。但由于芯片供应短缺和成本上升，这些公司开始寻找替代方案。AMD借此市场机会，预计2024年其AI芯片销售额将达到45亿美元。本次报道中，OpenAI计划采用AMD的新型MI300X芯片，通过微软云服务平台Azure使用。</p><p>据消息人士透露，至少从去年开始，OpenAI就开始讨论解决公司所依赖的昂贵AI芯片短缺的问题。据The Information报道，OpenAI几个月来一直在与博通合作，以构建其首款专注于推理的AI芯片。目前OpenAI对训练芯片的需求更大，但分析师预测，随着更多AI应用程序的部署，其对推理芯片的需求可能会超过训练芯片。</p><p>目前，OpenAI已组建了一支约20人的芯片团队，由曾在<a href=\"https://laohu8.com/S/GOOG\">谷歌</a>打造张量处理单元 (TPU) 的顶尖工程师主导，团队成员有前谷歌硬件工程师Thomas Norrie和前谷歌TPU负责人Richard Ho。</p><p>据消息人士补充，OpenAI对从英伟达挖人一直持谨慎态度，该公司希望与英伟达保持良好的关系，特别是在获得其新一代Blackwell芯片方面。英伟达拒绝置评。</p><p><strong>结语：自研芯片、寻求不同厂商合作，OpenAI努力降低成本</strong></p><p>OpenAI通过与博通、台积电合作自研芯片，并寻求与不同芯片供应商的合作，有望有效缓解芯片昂贵且短缺的局面。这一策略与<a href=\"https://laohu8.com/S/AMZN\">亚马逊</a>、Meta、谷歌和微软的做法类似。</p><p>据消息人士透露，OpenAI预计今年将亏损50亿美元，收入为37亿美元。面对高昂的计算成本，OpenAI暂停了构建芯片代工厂的计划，转而专注于内部芯片设计，这似乎是目前最明智的决策。</p></body></html>","source":"ifeng_tech","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>OpenAI大动作！自研AI芯片，预计2026年投产</title>\n<style 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margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nOpenAI大动作！自研AI芯片，预计2026年投产\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-10-30 17:56 北京时间&nbsp;&nbsp;&nbsp;<a href=https://tech.ifeng.com/c/8e6oBOPiGdI><strong>智东西</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>编译 | 汪越编辑 | 漠影智东西10月30日消息，据《路透社》报道，OpenAI正与半导体设备供应商博通（Broadcom）以及台积电（TSMC）合作，计划于2026年制造其首个定制设计芯片。目前，除了使用英伟达芯片外，OpenAI还计划通过微软云平台Azure使用AMD芯片。10月初，据《路透社》报道，OpenAI已经研究了多种实现芯片供应多样化和降低成本的策略，包括建立一个芯片制造代工厂。...</p>\n\n<a href=\"https://tech.ifeng.com/c/8e6oBOPiGdI\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","IE000KEQY171.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","MSFT":"微软","BK4591":"室温超导概念","BK4529":"IDC概念","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","IE000ITXATA3.USD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (USD) ACC","IE00B3SWFQ91.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) INC","IE0034235303.USD":"PINEBRIDGE US RESEARCH ENHANCED CORE EQUITY \"A\" (USD) ACC","BK4554":"元宇宙及AR概念","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","3NVD.UK":"LS 3X NVIDIA","LU0056508442.USD":"贝莱德世界科技基金A2","AVGO":"博通","AMZN":"亚马逊","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","BK4575":"芯片概念","LU0068578508.USD":"First Eagle Amundi International Cl AU-C USD","2NVD.UK":"2X NVIDIA 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漠影智东西10月30日消息，据《路透社》报道，OpenAI正与半导体设备供应商博通（Broadcom）以及台积电（TSMC）合作，计划于2026年制造其首个定制设计芯片。目前，除了使用英伟达芯片外，OpenAI还计划通过微软云平台Azure使用AMD芯片。10月初，据《路透社》报道，OpenAI已经研究了多种实现芯片供应多样化和降低成本的策略，包括建立一个芯片制造代工厂。然而，据匿名人士透露，由于构建代工厂所需的成本和时间过高，该公司目前暂时放弃了芯片代工计划，转而专注于内部芯片设计工作。OpenAI、AMD和台积电拒绝置评。博通没有立即回应置评请求。目前，英伟达的芯片市占率超过80%，微软、Meta及OpenAI等都是其主要客户。但由于芯片供应短缺和成本上升，这些公司开始寻找替代方案。AMD借此市场机会，预计2024年其AI芯片销售额将达到45亿美元。本次报道中，OpenAI计划采用AMD的新型MI300X芯片，通过微软云服务平台Azure使用。据消息人士透露，至少从去年开始，OpenAI就开始讨论解决公司所依赖的昂贵AI芯片短缺的问题。据The Information报道，OpenAI几个月来一直在与博通合作，以构建其首款专注于推理的AI芯片。目前OpenAI对训练芯片的需求更大，但分析师预测，随着更多AI应用程序的部署，其对推理芯片的需求可能会超过训练芯片。目前，OpenAI已组建了一支约20人的芯片团队，由曾在谷歌打造张量处理单元 (TPU) 的顶尖工程师主导，团队成员有前谷歌硬件工程师Thomas Norrie和前谷歌TPU负责人Richard Ho。据消息人士补充，OpenAI对从英伟达挖人一直持谨慎态度，该公司希望与英伟达保持良好的关系，特别是在获得其新一代Blackwell芯片方面。英伟达拒绝置评。结语：自研芯片、寻求不同厂商合作，OpenAI努力降低成本OpenAI通过与博通、台积电合作自研芯片，并寻求与不同芯片供应商的合作，有望有效缓解芯片昂贵且短缺的局面。这一策略与亚马逊、Meta、谷歌和微软的做法类似。据消息人士透露，OpenAI预计今年将亏损50亿美元，收入为37亿美元。面对高昂的计算成本，OpenAI暂停了构建芯片代工厂的计划，转而专注于内部芯片设计，这似乎是目前最明智的决策。","news_type":1},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"}],"isCommentEnd":false,"newsSizeData":{"likeSize":0,"commentSize":1,"repostSize":1,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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