尼康官宣旗下首款半导体后端工艺用光刻机预计2026财年发售

美港电讯10-24

【尼康官宣旗下首款半导体后端工艺用光刻机预计2026财年发售】金十数据10月24日讯，尼康宣布公司正在研发一款面向半导体先进封装工艺应用、兼具高分辨率及高生产性能的1.0微米分辨率数字光刻机，该设备预计在尼康2026财年内发售。

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尼康官宣旗下首款半导体后端工艺用光刻机 预计2026财年发售

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尼康官宣旗下首款半导体后端工艺用光刻机预计2026财年发售