抢当英伟达H200“平替” AMD新款AI芯片年底前投产

南方都市报10-11

当地时间10月10日，AMD发布新一代AI芯片MI325X，多项性能超越英伟达H200芯片，试图进一步撼动英伟达在数据中心GPU市场的垄断地位。　　MI325X沿用CDNA 3的GPU架构，和上一代MI300X芯片搭载HBM3内存相比，MI325X升级到HBM3e（第五代）高带宽内存，拥有256GB的内存容量和6TB/s的带宽，容量和带宽分别约为英伟达H200的1.8倍和1.3倍。　　算力层面，...

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3的GPU架构，和上一代MI300X芯片搭载HBM3内存相比，MI325X升级到HBM3e（第五代）高带宽内存，拥有256GB的内存容量和6TB/s的带宽，容量和带宽分别约为英伟达H200的1.8倍和1.3倍。　　算力层面，MI325X在8位浮点数（FP8）和16位浮点数（FP16）精度下的峰值理论运算性能，分别为2.6 PFLOPs（即每秒2.6千万亿次浮点运算）和1.3 PFLOPs，比H200均高出约30%。浮点数越小，可以减少存储需求并提高计算吞吐量。 AMD MI325X芯片图片。　　为了更直观凸显性能优势，10月10日的新品发布会上，AMD CEO苏姿丰（Lisa Su）还提及MI325X在Meta Llama模型的训练和推理性能数据——　　由8张MI325X组成的服务器平台，在Llama-3.1 405B模型上的推理性能，比英伟达H200 HGX平台高出40%；在AI训练上，单张MI325X训练Llama-2 7B的训练性能为H200的1.1倍，8张MI325X训练Llama-2 70B的性能与H200持平。　　AMD预告称，MI325X有望于今年第四季度投产，并从明年第一季度供货给戴尔、惠普、联想等合作厂商。　　今年6月，英伟达和AMD相继宣布，将GPU迭代节奏从“两年一更”加速为“一年一更”。此次发布会上，AMD披露了后续的年更路线图：下一代MI350系列的首款芯片MI355X，预计2025年下半年问世；2026年进一步迭代为MI400型号，并使用新一代CDNA架构。　　其中，MI355X升级为CDNA 4架构，配置288GB容量、8TB/s带宽的HBM3e高性能带宽内存。算力性能上，MI355X在FP8和FP16精度下的运算性能比MI325X提升约77%；同时还将新增对FP4和FP6数据类型的支持，峰值运算性能达9.2PFLOPs。值得一提的是，MI355X会首次采用3纳米制造工艺，和英伟达预计2026年上市的下一代Rubin GPU的制程相同。　　大模型浪潮催生数据中心对GPU的热切需求，苏姿丰预测，到2028年，数据中心、AI和加速器市场的价值将达到5000亿美元。市场调研机构的数据显示，英伟达占据数据中心GPU市场9成以上的份额，作为其最核心竞争对手的AMD仅能争抢少量的“蛋糕”。　　但AMD去年12月推出MI300X和MI300A两款AI芯片，凭借性价比优势，日渐得到行业巨头青睐。微软、Meta和甲骨文公司此前都宣布采用MI300X芯片。近日又有韩媒报道称，三星斥资约270亿韩元购买约2000颗MI300X芯片，这是三星首度引入非英伟达AI GPU。　　公司财报显示，得益于MI300X等芯片的出货量大增，AMD今年第二季度数据中心业务营收达28亿美元，同比增长115%，环比增长21%。该公司在二季度财报电话会上披露，MI300芯片的季度收入首次超过10亿美元，预计数据中心的GPU收入今年有望超过 45亿美元。（文章来源：南方都市报）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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