AMD(AMD.US)发布新人工智能芯片旨在与英伟达(NVDA.US)Blackwell展开竞争

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智通财经APP获悉，AMD(AMD.US)宣布计划在今年第四季度开始量产新款MI325X人工智能芯片，以增强其在由英伟达(NVDA.US)主导的市场中的竞争力。该公司在周四于旧金山举行的活动中公布了这一消息，目前微软(MSFT.US)和Meta(META.US)等大型科技公司对人工智能处理器的需求大幅超出供应量。AMD表示，MI325X采用与去年推出的MI300X相同的架构，配备了一种全新的内存...

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href=http://www.zhitongcaijing.com/content/detail/1192673.html><strong>智通财经</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>智通财经APP获悉，AMD(AMD.US)宣布计划在今年第四季度开始量产新款MI325X人工智能芯片，以增强其在由英伟达(NVDA.US)主导的市场中的竞争力。该公司在周四于旧金山举行的活动中公布了这一消息，目前微软(MSFT.US)和Meta(META.US)等大型科技公司对人工智能处理器的需求大幅超出供应量。AMD表示，MI325X采用与去年推出的MI300X相同的架构，配备了一种全新的内存...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1192673.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1923623000.USD","symbol_name":"Natixis Thematics AI & Robotics Fund R/A 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IOD模块、3.5D封装、1530亿个晶体管和304个计算单元。值得注意的是，MI325X的功耗达到1000W，相较于MI320X增加了750W。MI325X还支持八块芯片并行工作，形成一个性能强大的平台，具备2TB的HBM3E内存和48TB/s的带宽。尽管发布新产品，AMD股价在活动期间略有下跌。公司还发布了几款新的网络芯片，以加快数据中心内的芯片和系统之间的数据传输速度。此外，AMD还发布了代号为“都灵”的新一代服务器中央处理器(CPU)，其中的一个版本专门为图形处理单元(GPU)提供数据支持，进一步加快人工智能处理速度。这款旗舰芯片拥有近200个处理内核，售价14,813美元，采用Zen 5架构，可为高级人工智能数据计算提供高达37%的速度提升。虽然AMD推出新产品，预计短期内不会对英伟达的数据中心营收产生重大影响。根据市场分析，今年7月AMD将其AI芯片的收入预期从40亿美元上调至45亿美元，受益于生成式人工智能产品的热潮以及对MI300X芯片的强劲需求。分析师预计，AMD今年的数据中心收入将达到128.3亿美元，而英伟达的数据中心收入预期则高达1103.6亿美元。截至周四收盘，AMD股价跌4%，报164.18美元。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; 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AMD(AMD.US)发布新人工智能芯片 旨在与英伟达(NVDA.US)Blackwell展开竞争

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AMD(AMD.US)发布新人工智能芯片旨在与英伟达(NVDA.US)Blackwell展开竞争