深南电路：已具备FC-BGA封装基板16层及以下产品批量生产能力

美港电讯09-02

【深南电路：已具备FC-BGA封装基板16层及以下产品批量生产能力】金十数据9月2日讯，深南电路在互动平台表示，FC-BGA封装基板的制造涉及SAP工艺，公司封装基板业务拥有SAP工艺能力，现已具备FC-BGA封装基板16层及以下产品批量生产能力，16层以上产品具备样品制造能力，各阶产品对应的产线验证导入、送样认证等工作有序推进。

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