德龙激光：上半年集成电路先进封装相关设备获得批量订单

E公司09-04

e公司讯，德龙激光(688170)近日接受机构调研时表示，公司从2021年开始布局集成电路先进封装应用，如激光开槽（low-k）、晶圆打标等激光精细微加工设备，2023年重点研发出玻璃通孔（TGV）、模组钻孔（TMV）、激光解键合等激光精细微加工设备新产品。公司上半年集成电路先进封装相关设备获得了批量订单，部分新产品尚处于工艺验证阶段。今年上半年公司集成电路先进封装应用相关设备订单同比增长，但因...

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