先进封装之战愈演愈烈三星重组团队以应对挑战

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8月，台积电收购群创台南工厂，将其作为CoWoS生产基地，标志着台积电与三星电子在半导体封装领域的持续竞争中迈出了重要一步。此次收购是台积电保持市场主导地位的更广泛战略的一部分，目前台积电凭借其先进的2.5D封装技术CoWoS稳固占据了62%的市场份额。据业内人士9月1日透露，三星电子设备解决方案（DS）部门最近进行了组织重组和人员扩充，以增强其封装竞争力。此举正值三星在半导体代工领域面临越来越大...

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href=https://tech.ifeng.com/c/8cYD2hwVHqC><strong>爱集微APP</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>8月，台积电收购群创台南工厂，将其作为CoWoS生产基地，标志着台积电与三星电子在半导体封装领域的持续竞争中迈出了重要一步。此次收购是台积电保持市场主导地位的更广泛战略的一部分，目前台积电凭借其先进的2.5D封装技术CoWoS稳固占据了62%的市场份额。据业内人士9月1日透露，三星电子设备解决方案（DS）部门最近进行了组织重组和人员扩充，以增强其封装竞争力。此举正值三星在半导体代工领域面临越来越大...</p>\n\n<a 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先进封装之战愈演愈烈 三星重组团队以应对挑战

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先进封装之战愈演愈烈三星重组团队以应对挑战