【英媒：软银与英特尔的AI芯片合作谈判失败告终，目标转向台积电】金十数据8月15日讯，据英国金融时报报道，软银曾与英特尔(INTC.

美港电讯08-15

【英媒：软银与英特尔的AI芯片合作谈判失败告终，目标转向台积电】金十数据8月15日讯，据英国金融时报报道，软银曾与英特尔(INTC.O)就生产一款人工智能芯片与英伟达(NVDA.O)竞争进行谈判，但由于这家美国芯片制造商难以满足软银的要求，该计划以失败告终。知情人士表示，与英特尔的合作谈判将加速软银将Arm的芯片设计与最新收购的Graphcore的生产专长相结合，从而打造出一个与英伟达市场领先的AI芯片相竞争的产品。软银CEO孙正义计划投资数十亿美元，试图将该集团置于AI热潮的中心。他已向大型科技公司提出了雄心勃勃的计划，包括芯片生产和软件，以及为容纳其处理器的数据中心提供电力。这些人士表示，与英特尔的谈判在最近几个月破裂。软银目前正专注于与台积电(TSM.N)进行谈判。

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