每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2.

汇通网08-06

每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2. 英媒：英伟达下一代芯片生产面临挑战。 3. Blackwell芯片延迟交付？英伟达回应：样品试用已经广泛开始，产量有望在下半年增加。 4. 英伟达CEO 6-7月累计套利近5亿美元股票。 5. 台积电被摩根士丹利评为首选股。 6. 业内人士：台积电2025年5/3纳米制程产品将继续涨价，涨幅约3~8%。 7. AI芯片初创公司Groq在新一轮融资中募集到6.4亿美元，贝莱德领投。 8. 国芯科技：公司具备开发高频CPU产品能力，首款RISC-V CPU芯片主频超500MHz。 9. 马斯克：已为第二位人类患者成功植入脑机芯片。 10. Yole：预计2024年DRAM收入将达到980亿美元，同比增长88%。 11. Amkor：已将韩国工厂2.5D封装产能提高两倍。

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2457065558?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-08-06 13:18","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2457065558","market":"sg","top_or_hot":-1,"title":"每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2.","media":"汇通网","content":"<html><body><p>每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2. 英媒：英伟达下一代芯片生产面临挑战。 3. Blackwell芯片延迟交付？英伟达回应：样品试用已经广泛开始，产量有望在下半年增加。 4. 英伟达CEO 6-7月累计套利近5亿美元股票。 5. 台积电被摩根士丹利评为首选股。 6. 业内人士：台积电2025年5/3纳米制程产品将继续涨价，涨幅约3~8%。 7. AI芯片初创公司Groq在新一轮融资中募集到6.4亿美元，贝莱德领投。 8. 国芯科技：公司具备开发高频CPU产品能力，首款RISC-V CPU芯片主频超500MHz。 9. 马斯克：已为第二位人类患者成功植入脑机芯片。 10. Yole：预计2024年DRAM收入将达到980亿美元，同比增长88%。 11. Amkor：已将韩国工厂2.5D封装产能提高两倍。</p></body></html>","source":"live_huitong","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>7x24快讯</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n7x24快讯\n</h2>\n\n<h4 class=\"meta\">\n\n<p class=\"head\">\n<strong class=\"h-name small\">汇通网</strong><span class=\"h-time small\">2024-08-06 13:18</span>\n</p>\n\n</h4>\n\n</header>\n<article>\n<html><body><p>每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2. 英媒：英伟达下一代芯片生产面临挑战。 3. Blackwell芯片延迟交付？英伟达回应：样品试用已经广泛开始，产量有望在下半年增加。 4. 英伟达CEO 6-7月累计套利近5亿美元股票。 5. 台积电被摩根士丹利评为首选股。 6. 业内人士：台积电2025年5/3纳米制程产品将继续涨价，涨幅约3~8%。 7. AI芯片初创公司Groq在新一轮融资中募集到6.4亿美元，贝莱德领投。 8. 国芯科技：公司具备开发高频CPU产品能力，首款RISC-V CPU芯片主频超500MHz。 9. 马斯克：已为第二位人类患者成功植入脑机芯片。 10. Yole：预计2024年DRAM收入将达到980亿美元，同比增长88%。 11. Amkor：已将韩国工厂2.5D封装产能提高两倍。</p></body></html>\n\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://kx.fx678.com/\">汇通网</a> </p>\n\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n</div>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0048584097.USD","symbol_name":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","start_time":0,"source_url":"https://kx.fx678.com/","article_id":"2457065558","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2457065558","pubTimestamp":1722921523,"sourceInfo":{"source_id":"live_huitong","name":"汇通网"},"weMediaInfo":null,"summary":"每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2. 英媒：英伟达下一代芯片生产面临挑战。 3. Blackwell芯","collect":0,"end_time":0,"defaultTopTitle":"fx678.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159813":"芯片","688262":"国芯科技","LU0048584097.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","BK4587":"ChatGPT概念","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU0820561909.HKD":"ALLIANZ INCOME AND GROWTH \"AM\" (HKD) INC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU2063271972.USD":"富兰克林创新领域基金","BK4588":"碎股","BK4503":"景林资产持仓","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","LU0314104364.USD":"MANULIFE GF AMERICAN GROWTH \"AA\" (USD) INC","03145":"华夏亚洲高息股","LU0097036916.USD":"贝莱德美国增长A2 USD","IE00B19Z8X17.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH  \"AG\" (USD) ACC","BK4551":"寇图资本持仓","LU2326559502.SGD":"Natixis Loomis Sayles US Growth Equity P/A SGD-H","LU2087621335.USD":"ALLSPRING GLOBAL FACTOR ENHANCED EQUITY \"A\" (USD) ACC","LU0689472784.USD":"安联收益及增长基金Cl AM AT Acc","BK0231":"软件信息","LU0056508442.USD":"贝莱德世界科技基金A2","SMSD.UK":"三星电子","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU1861215975.USD":"贝莱德新一代科技基金 A2","EWT":"台湾ETF-iShares MSCI","TSLA":"特斯拉","LU1861558580.USD":"日兴方舟颠覆性创新基金B","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU1074936037.SGD":"JPMorgan Funds - US Value A (acc) SGD","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU0731783394.SGD":"Fidelity Global Dividend A-MINCOME(G)-SGD","LU1668664300.SGD":"Blackrock World Financials A2 SGD-H","BK4170":"电脑硬件、储存设备及电脑周边","BK4529":"IDC概念","BLK":"贝莱德","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","TSM":"台积电","DRAM":"达泰莱","LU1861559042.SGD":"日兴方舟颠覆性创新基金B SGD","SSNLF":"三星电子","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","NVDA":"英伟达","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","BK4585":"ETF&股票定投概念","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD"},"translate_title":"Summary of daily chip industry trends (2024-08-06) 1. It is reported that Samsung Electronics and Naver will end AI acceleration chips after the launch of Mach-1 chips","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159813":1,"688262":1,"TSM":1,"TSLA":1,"SSNLF":1,"SMSD.UK":1,"NVDA":1,"TWmain":1,"DRAM":1,"BLK":1,"03145":0.6,"EWT":0.6},"content_text":"每日芯片行业动态汇总（2024-08-06） 1. 消息称三星电子与Naver将在Mach-1芯片推出后结束AI加速芯片开发合作 2. 英媒：英伟达下一代芯片生产面临挑战。 3. Blackwell芯片延迟交付？英伟达回应：样品试用已经广泛开始，产量有望在下半年增加。 4. 英伟达CEO 6-7月累计套利近5亿美元股票。 5. 台积电被摩根士丹利评为首选股。 6. 业内人士：台积电2025年5/3纳米制程产品将继续涨价，涨幅约3~8%。 7. AI芯片初创公司Groq在新一轮融资中募集到6.4亿美元，贝莱德领投。 8. 国芯科技：公司具备开发高频CPU产品能力，首款RISC-V CPU芯片主频超500MHz。 9. 马斯克：已为第二位人类患者成功植入脑机芯片。 10. Yole：预计2024年DRAM收入将达到980亿美元，同比增长88%。 11. Amkor：已将韩国工厂2.5D封装产能提高两倍。","kind":null,"is_publish_news":false,"is_publish_highlight":false,"is_publish_live":true,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.26.2","shortVersion":"4.26.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2457065558"}