机构：Q2全球硅晶圆出货量环比增长7.1%，市场正在复苏

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根据SEMI旗下的Silicon Manufacturers Group（SMG）发布的硅晶圆季度分析报告，2024年第二季度全球硅晶圆出货量环比增长7.1%，达到30.35亿平方英寸（MSI），但与去年同期的33.31亿平方英寸相比下降8.9%。SEMI SMG主席，GlobalWafers（环球晶）副总裁李崇伟表示：“硅晶圆市场正在复苏，这得益于与数据中心和生成式人工智能（AI）产品相关的强劲...

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SMG主席，GlobalWafers（环球晶）副总裁李崇伟表示：“硅晶圆市场正在复苏，这得益于与数据中心和生成式人工智能（AI）产品相关的强劲需求。虽然不同应用的复苏不平衡，但第二季度300mm晶圆出货量环比增长8%，在所有晶圆尺寸中表现最佳。越来越多的新半导体晶圆厂正在建设中或扩大产能。这种扩张以及向一万亿美元半导体市场迈进的长期趋势，将不可避免有更多的硅晶圆需求。”在2024年第一季度，全球硅晶圆出货量环比下降5.4%，至28.34亿平方英寸，较去年同期的32.65亿平方英寸下降13.2%。李崇伟曾表示，IC晶圆厂利用率持续下降和库存调整导致2024年第一季度所有晶圆尺寸均出现负增长，一些晶圆厂的利用率在2023年第四季度触底。（校对/孙乐）","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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