TrendForce：英伟达(NVDA.US)Blackwell高耗能推动散热需求预估2024年底液冷方案渗透率将达10%

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智通财经APP获悉，7月30日，TrendForce集邦咨询发文称，随着高速运算的需求成长，更有效的AI Server（AI服务器）散热方案也受到重视。根据TrendForce集邦咨询最新AI Server报告，由于英伟达(NVDA.US)将在2024年底前推出新一代平台Blackwell，届时大型CSP（云端服务业者）也会开始建置Blackwell新平台的AI Server数据中心，预估有机会...

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href=http://www.zhitongcaijing.com/content/detail/1157280.html><strong>智通财经网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>智通财经APP获悉，7月30日，TrendForce集邦咨询发文称，随着高速运算的需求成长，更有效的AI Server（AI服务器）散热方案也受到重视。根据TrendForce集邦咨询最新AI Server报告，由于英伟达(NVDA.US)将在2024年底前推出新一代平台Blackwell，届时大型CSP（云端服务业者）也会开始建置Blackwell新平台的AI Server数据中心，预估有机会...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1157280.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0079474960.USD","symbol_name":"联博美国增长基金A","start_time":0,"source_url":"http://www.zhitongcaijing.com/content/detail/1157280.html","article_id":"2455567145","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2455567145","pubTimestamp":1722318296,"sourceInfo":{"source_id":"highlight_zhitongcaijin","name":"智通财经网"},"weMediaInfo":null,"summary":"气冷、液冷并行方案满足更高散热需求根据TrendForce集邦咨询调查，NVIDIA Blackwell平台将于2025年正式放量，取代既有的Hopper平台，成为NVIDIA高端GPU主力方案，占整体高端产品近83%。NVL72因其AI Server整体设计及散热系统较为复杂，预计将于2025年推出。TrendForce集邦咨询表示，在NVIDIA大力扩展CSPs客群的情况下，预估2025年GB200折算NVL36合计出货数量可望达6万柜，而GB200的Blackwell GPU用量可望达210-220万颗。TrendForce集邦咨询指出，NVL72需较完善的液冷散热方案，难度较高。","collect":0,"end_time":0,"defaultTopTitle":"zhitongcaijing.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0079474960.USD":"联博美国增长基金A","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","IE00BN29S564.USD":"JANUS HENDERSON BALANCED \"A3\" (USD) INC","LU0056508442.USD":"贝莱德世界科技基金A2","LU0061474960.USD":"天利环球焦点基金AU Acc","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","IE00B19Z9505.USD":"美盛-美国大盘成长股A Acc","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","IE00BYXW3230.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"AA\" 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TDP)持续提高，如B200芯片的TDP将达1,000W，传统气冷散热方案不足以满足需求；GB200 NVL36及NVL72整机柜的TDP甚至将高达70kW及近140kW，需要搭配液冷方案方以有效解决散热问题。据TrendForce集邦咨询了解， GB200 NVL36架构初期将以气冷、液冷并行方案为主；NVL72因有更高散热能力需求，原则上优先使用液冷方案。观察现行GB200机柜系统液冷散热供应链，主要可分水冷板(Cold Plate)、冷却分配系统(Coolant Distribution Unit, CDU)、分歧管(Manifold)、快接头(Quick Disconnect, QD)和风扇背门(Rear Door Heat Exchanger, RDHx)等五大零部件。TrendForce集邦咨询指出，CDU为其中的关键系统，负责调节冷却剂的流量至整个系统，确保机柜温度控制在预设的TDP范围内。TrendForce集邦咨询观察，目前针对NVIDIA AI方案，以Vertiv（维谛技术）为主力CDU供应商，奇鋐、双鸿、台达电和CoolIT等持续测试验证中。2025年GB200出货量估可达6万柜，促Blackwell平台成市场主流、将占NVIDIA高端GPU逾8成根据TrendForce集邦咨询观察，2025年NVIDIA将以HGX、GB200 Rack及MGX等多元组态AI Server，分攻CSPs及企业型客户，预估这三个机种的出货比例约为5:4:1。HGX平台可较无缝对接现有Hopper平台设计，使CSPs或大型企业客户能迅速采用。GB200整柜AI Sever方案将以超大型CSPs为主打，TrendForce集邦咨询预期NVIDIA将于2024年底先导入NVL36组态，以便快速进入市场。NVL72因其AI Server整体设计及散热系统较为复杂，预计将于2025年推出。TrendForce集邦咨询表示，在NVIDIA大力扩展CSPs客群的情况下，预估2025年GB200折算NVL36合计出货数量可望达6万柜，而GB200的Blackwell GPU用量可望达210-220万颗。然而，终端客户采用GB200 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TrendForce：英伟达(NVDA.US)Blackwell高耗能推动散热需求 预估2024年底液冷方案渗透率将达10%

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TrendForce：英伟达(NVDA.US)Blackwell高耗能推动散热需求预估2024年底液冷方案渗透率将达10%