每日芯片行业动态汇总（2024-07-26） 1. 晶圆代工厂产能利用率全面回升中。 2. AMD由于质量问题延后锐龙9000上市时间。

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每日芯片行业动态汇总（2024-07-26） 1. 晶圆代工厂产能利用率全面回升中。 2. AMD由于质量问题延后锐龙9000上市时间。 3. 三安半导体芯片二厂M6B设备搬入，预计12月8吋SiC芯片投产。 4. 英伟达合作伙伴SMC据悉正筹集9.5亿美元，借力AI服务器热潮刺激业务发展。 5. 三大存储器厂今年NAND资本支出不增反减，Q3 NAND Flash或供过于求。 6. 龙芯...

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