发布先进封装低温薄膜沉积系统，看好公司ALD&CVD设备快速放量

东吴证券07-17

（以下内容从东吴证券《发布先进封装低温薄膜沉积系统，看好公司ALD&CVD设备快速放量》研报附件原文摘录）微导纳米(688147)投资要点事件：微导纳米在“第十六届集成电路封测产业链创新发展论坛（CIPA2024）”上首次发布了自主研发的“先进封装低温薄膜应用解决方案”。该方案针对半导体领域2.5D和3D先进封装技术的低温工艺特殊需求而设计，能够在50~200°C的低温温度区间内实现高均匀性、...

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