龙芯中科：3C6000系列相关芯片预计将在四季度完成产品化工作

第一财经07-19

龙芯中科在投资者互动平台表示，3C6000系列初样已回片，在测试当中，总体上符合预期。相关芯片预计将在四季度完成产品化工作。

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