盛美上海:半导体设备重组攻坚，抓紧国家政策，做大做强突破国外封锁

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登录新浪财经APP 搜索【信披】查看更多考评等级投资者提问：科创板8条支持硬科技重组做大做强突破卡脖子，公司作为半导体设备核心设备供应商，是否联合科创板上下游的半导体设备零部件、以及同级的设备公司进行联合重组进行半导体设备攻坚做大做强，早日突破国外封锁，为祖国的发展添砖加瓦，公司应该抓紧国家给的政策？请问接下来有何动作？董秘回答(盛美上海SH688082)：尊敬的投资者您好，感谢您的建议。公司会...

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