颀中科技(688352.SH)：可为客户提供包括铜柱凸块(Cu Pillar)等多种高端金属凸块制造

格隆汇资讯07-10

格隆汇7月10日丨颀中科技(688352.SH)近日在接待机构投资者调研时表示，依托在显示驱动芯片封测领域多年来的耕耘以及对凸块制造技术的积累，公司于2015年将业务拓展至非显示类芯片封测市场，目前该领域已日渐成为公司业务重要的组成部分以及未来重点发展的板块。公司现可为客户提供包括铜柱凸块(Cu Pillar)、铜镍金凸块(CuNiAu Bumping)、锡凸块(Sn Bumping)在内的多种...

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