广合科技: PCB在工业机器人应用领域投入明细及通信领域光模块类型概述

问董秘07-06

投资者提问：通过招股说明书可知贵公司PCB在工业机器人上有应用，在可应用于人形机器人的HDI板的研发投入如何？通信领域在光模块的应用主要有哪些类型？是否有封装基板产品或是研发储备？董秘回答(广合科技SZ001389)：公司HDI板的研发投入主要面向的产品类型是云计算及AI、交换、工控、安防、汽车等领域，包括工业机器人等；公司通信领域在光模块的应用主要是通讯交换机（400G、800G）产品；公司暂未...

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